Device

ABSTRACT

A device includes a light emitting element, a light receiving element, an electronic part capable of processing a signal output from the light receiving element, an optical member covering the light emitting element and the light receiving element, and a board on which the light emitting element, the light receiving element, the electronic part, and the optical member are mounted. The board includes conductor wiring electrically connected to the light receiving element.

BACKGROUND

1. Technical Field

The present disclosure relates to a device capable of detecting aparticular substance.

2. Background Art

There is an apparatus such as an air conditioner which includes a gasdetecting device. The gas detecting device can detect a presence or anabsence of a particular gas, a concentration of a gas, and others byutilizing characteristics of a variety of gases which absorb infraredlight in different wavelengths for each gas. The air conditionerincluding the gas detecting device is capable of switching between anexternal air circulation mode and an internal air circulation mode basedon a concentration of a gas such as carbon dioxide output from the gasdetecting device.

FIGS. 44 and 45 are a cross-sectional view and an exploded perspectiveview, respectively, illustrating a conventional gas component detectingdevice described in Unexamined Japanese Patent Publication No.2012-220353 (hereinafter referred as PTL). The gas component detectingdevice of the PTL includes circuit block 1001 and optical block 1002.

In circuit block 1001, body 1010 accommodates light emitting unit 1003,light receiving unit 1004, wavelength filter 1005, and wiring board 1011within recess 1100. Light emitting unit 1003 emits infrared light easilyabsorbable by a detection target gas. Light receiving unit 1004 receivesinfrared light and converts the received light into an electric signal.Wavelength filter 1005 constitutes a band pass filter which has awavelength band as a transmission band containing a wavelength ofinfrared light emitted from light emitting unit 1003. Signal processingcircuit unit 1006 is mounted on wiring board 1011. Signal processingcircuit unit 1006 drives light emitting unit 1003 to allow emission ofinfrared light from light emitting unit 1003. In addition, signalprocessing circuit unit 1006 processes the signal output from lightreceiving unit 1004. Body 1010 is provided with a plurality ofinsert-molded terminals 1012 (see FIG. 45). Terminals 1012 areelectrically connected with wiring board 1011.

In optical block 1002, cover 1020 accommodates light guide 1008 therein.Light guide 1008 is composed of first reflection mirror 1080, secondreflection mirror 1081, third reflection mirror 1082, and fourthreflection mirror 1083. According to the gas detecting device, fourthreflection mirror 1083 closes an opening of recess 1100 of body 1010.Cover 1020 in a state accommodating light guide 1008 within recess 1200is joined with body 1010. Cover 1020 is provided with air hole 1201formed at a center thereof and penetrating cover 1020. According to thegas detecting device, dust filter 1007 covers air hole 1201.

According to the gas detecting device of the PTL, outside air containingthe detection target gas is introduced into light guide 1008 via airhole 1201. According to the gas detecting device, an amount of infraredlight received by light receiving unit 1004 decreases by absorption ofthe infrared light, emitted from light emitting unit 1003, by thedetection target gas. The gas detecting device detects a concentrationof a gas component based on a processing result of the signal outputfrom light receiving unit 1004 by processing circuit unit 1006. The gasdetecting device is capable of outputting a detection signal indicatingthe concentration of the gas component to the outside via terminals1012.

FIG. 46 is a perspective view illustrating conventional gas detector1310 described in WO 2005/012869. Gas detector 1310 includes emitter1332 capable of emitting emission energy, sensors 1334A and 1334B, andhousing 1318.

Housing 1318 includes side walls 1318A, 1318B, 1318C, and 1318D, andopening 1318E. In gas detector 1310, a detection gas flows in adirection of an arrow G with respect to opening 1318E of housing 1318.Sensor 1334A includes optical filter 1336A. Optical filter 1336Atransmits light having a wavelength to be absorbed by the detection gas.Sensor 1334B includes optical filter 1336B. Optical filter 1336B doesnot transmit the light having the wavelength to be absorbed by thedetection gas. Housing 1318 includes concave mirrors 1338A and 1338B.According to gas detector 1310, the emission energy emitted from emitter1332 reflects on a surface of concave mirror 1338A, and enters sensor1334A via filter 1336A (see fine solid line arrows in FIG. 46).Similarly, according to gas detector 1310, the emission energy emittedfrom emitter 1332 reflects on a surface of concave mirror 1338B, andenters sensor 1334B via filter 1336B. Each of sensors 1334A and 1334Boutputs a signal corresponding to the entering emission energy. Thesesignals are input to control circuit 1316. Control circuit 1316 displaysa concentration of the detection gas on display 1320 based on the inputsignals.

SUMMARY

A device according to the present disclosure includes a light emittingelement, a light receiving element, an electronic part capable ofprocessing a signal output from the light receiving element, an opticalmember covering the light emitting element and the light receivingelement, and a board on which the light emitting element, the lightreceiving element, the electronic part, and the optical member aremounted. The board includes conductor wiring electrically connected tothe light receiving element.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a cross-sectional view schematically illustrating a deviceaccording to a first exemplary embodiment.

FIG. 2 is an explanatory exploded view illustrating the device accordingto the first exemplary embodiment.

FIG. 3 is a plan view illustrating an essential part of the deviceaccording to the first exemplary embodiment.

FIG. 4 is an explanatory side view illustrating the essential part ofthe device according to the first exemplary embodiment.

FIG. 5 is an explanatory perspective view illustrating the essentialpart of the device according to the first exemplary embodiment.

FIG. 6 is an exploded perspective view illustrating the essential partof the device according to the first exemplary embodiment.

FIG. 7 is an exploded perspective view illustrating the essential partof the device according to the first exemplary embodiment.

FIG. 8 is a plan view illustrating the essential part of the deviceaccording to the first exemplary embodiment.

FIG. 9 is a perspective view illustrating an external appearance of thedevice according to the first exemplary embodiment.

FIG. 10 is a cross-sectional view schematically illustrating anotherdevice according to the first exemplary embodiment.

FIG. 11 is a plan view illustrating an essential part of a still otherdevice according to the first exemplary embodiment.

FIG. 12 is an explanatory side view illustrating the essential part ofthe still other device according to the first exemplary embodiment.

FIG. 13 is a plan view illustrating an essential part of a further otherdevice according to the first exemplary embodiment.

FIG. 14 is an explanatory side view illustrating the essential part ofthe further other device according to the first exemplary embodiment.

FIG. 15 is a cross-sectional view schematically illustrating a deviceaccording to a second exemplary embodiment.

FIG. 16 is a perspective view illustrating an external appearance of anessential part of the device according to the second exemplaryembodiment.

FIG. 17 is a bottom view illustrating an essential part of a deviceaccording to a third exemplary embodiment.

FIG. 18 is an explanatory cross-sectional view illustrating the deviceaccording to the third exemplary embodiment.

FIG. 19A is a cross-sectional view schematically illustrating a deviceaccording to a fourth exemplary embodiment.

FIG. 19B is a cross-sectional view schematically illustrating the devicetaken along another cutting plane according to the fourth exemplaryembodiment.

FIG. 20 is a bottom view illustrating an essential part of the deviceaccording to the fourth exemplary embodiment.

FIG. 21 is a plan view illustrating another essential part of the deviceaccording to the fourth exemplary embodiment.

FIG. 22 is a plan view illustrating a still other essential part of thedevice according to the fourth exemplary embodiment.

FIG. 23 is an explanatory operational view explaining operation of thedevice according to the fourth exemplary embodiment.

FIG. 24 is a plan view illustrating a further other essential part ofthe device according to the fourth exemplary embodiment.

FIG. 25 is an explanatory side view illustrating the further otheressential part of the device according to the fourth exemplaryembodiment.

FIG. 26 is an explanatory side view illustrating an essential part ofanother device according to the fourth exemplary embodiment.

FIG. 27 is a plan view illustrating an essential part of a still otherdevice according to the fourth exemplary embodiment.

FIG. 28 is an explanatory side view illustrating the essential part ofthe still other device according to the fourth exemplary embodiment.

FIG. 29 is an explanatory perspective view illustrating an essentialpart of a device according to a fifth exemplary embodiment.

FIG. 30A is a cross-sectional view schematically illustrating the deviceaccording to the fifth exemplary embodiment.

FIG. 30B is a cross-sectional view schematically illustrating the devicetaken along another cutting plane according to the fifth exemplaryembodiment.

FIG. 31 is a bottom view illustrating an essential part of a deviceaccording to a sixth exemplary embodiment.

FIG. 32 is an explanatory cross-sectional view illustrating theessential part of the device according to the sixth exemplaryembodiment.

FIG. 33 is an explanatory cross-sectional view illustrating a deviceaccording to a seventh exemplary embodiment.

FIG. 34 is a plan view illustrating an essential part of the deviceaccording to the seventh exemplary embodiment.

FIG. 35 is a cross-sectional view schematically illustrating anotheressential part of the device according to the seventh exemplaryembodiment.

FIG. 36 is an explanatory side view illustrating an essential part ofanother device according to the seventh exemplary embodiment.

FIG. 37 is an explanatory side view illustrating an essential part of astill other device according to the seventh exemplary embodiment.

FIG. 38 is a cross-sectional view schematically illustrating anessential part of a further other device according to the seventhexemplary embodiment.

FIG. 39 is a cross-sectional view schematically illustrating a deviceaccording to an eighth exemplary embodiment.

FIG. 40 is a cross-sectional view schematically illustrating anessential part of another device according to the eighth exemplaryembodiment.

FIG. 41 is an explanatory cross-sectional view illustrating an essentialpart of a device according to a ninth exemplary embodiment.

FIG. 42 is a plan view illustrating the essential part of the deviceaccording to the ninth exemplary embodiment.

FIG. 43 is a plan view illustrating a main part of a device according toa tenth exemplary embodiment.

FIG. 44 is a cross-sectional view of a conventional gas componentdetecting device.

FIG. 45 is an exploded perspective view of the conventional gascomponent detecting device.

FIG. 46 is a perspective view of another conventional gas detector.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS First Exemplary Embodiment

FIG. 1 and FIG. 2 are a schematic cross-sectional view and anexplanatory exploded view, respectively, illustrating device 10according to a first exemplary embodiment. Device 10 according to thisexemplary embodiment is a gas detecting device. Device 10 includes lightemitting element 1, light receiving elements 2, signal processingcircuit unit 7, optical member 4, and board 6. Signal processing circuitunit 7 processes signals output from light receiving elements 2. Opticalmember 4 covers light emitting element 1 and light receiving elements 2.Board 6 is a component on which light emitting element 1, lightreceiving elements 2, signal processing circuit unit 7, and opticalmember 4 are mounted. Board 6 includes conductor wiring 61 electricallyconnected to light receiving elements 2.

The structure of device 10 according to this exemplary embodiment canincrease a degree of freedom for electric connection with an outside.

A more specific configuration of device 10 according to this exemplaryembodiment is hereinafter described.

Device 10 includes light emitting element 1 which emits infrared light,light receiving elements 2 which photoelectrically convert infraredlight, and support body 3 which supports light emitting element 1 andlight receiving elements 2 on the one surface 30A side of support body 3with a predetermined distance between light emitting element 1 and lightreceiving elements 2. Device 10 includes optical member 4 which coversthe one surface 30A side of support body 3 via space 40A into which adetection target gas is introducible. Optical member 4 guides infraredlight emitted from light emitting element 1 toward light receivingelements 2. Device 10 includes optical filters 5 each disposed on acorresponding optical path along which infrared light emitted from lightemitting element 1 is guided toward the corresponding the lightreceiving element 2 side (see chain line arrows in FIG. 1). Each ofoptical filters 5 transmits infrared light contained in a predeterminedwavelength band. According to device 10, optical member 4 is fixed toboard 6 via support body 3, while board 6 includes conductor wiring 61electrically connected to light receiving elements 2 and outputtingsignals received from the light receiving elements 2 side to the outside(see FIG. 2).

According to device 10 in this exemplary embodiment, support body 3 isdisposed on board 6. An external shape of support body 3 is arectangular frame shape. Support body 3 is constituted by a resin moldedcomponent formed by a synthetic resin molded body. Board 6 has arectangular plate shape larger than the shape of support body 3. Board 6is constituted by a glass epoxy resin substrate. Board 6 includesconductor pattern wiring 63 (see FIG. 2) on front surface 60A of board6. Board 6 includes rear surface 60B opposite to front surface 60A.According to device 10, a plurality of electronic parts 71 are mountedon front surface 60A of board 6. Electronic parts 71 are electricallyconnected to wiring 63 via soldering (not shown). The plurality ofelectronic parts 71 are electrically connected to each other via wiring63 formed on board 6. The plurality of electronic parts 71 constitutesignal processing circuit unit 7. Signal processing circuit unit 7 isconfigured to allow emission of infrared light from light emittingelement 1 by controlling light emitting element 1. Signal processingcircuit unit 7 is configured to process signals output from lightreceiving elements 2 after receiving infrared light. Signal processingcircuit unit 7 performs signal processing such as amplification,waveform shaping, signal sampling, and signal A/D conversion of signalsoutput from light receiving elements 2. Signal processing circuit unit 7further performs signal processing such as signal calculation, signalcorrection, and determination that the detection target gas has anabnormal concentration, for example. In device 10, signal processingcircuit unit 7 is disposed within opening 31A of frame-shaped supportbody 3. In other words, electronic parts 71 capable of processingsignals output from light receiving elements 2 are mounted on board 6.According to device 10 structured such that electronic parts 71constituting signal processing circuit unit 7 are disposed in opening31A of frame-shaped support body 3, reduction of an entire size ofdevice 10 is achievable.

In device 10, front surface 60A of board 6 is exposed to an inside ofopening 31A of frame-shaped support body 3. Support body 3 is providedwith first recess 33 at an end of support body 3 on the one surface 30Aside. Light emitting element 1 is mounted on an inner bottom surface offirst recess 33 of support body 3. According to device 10, lightemitting element 1 is mounted on the inner bottom surface of firstrecess 33 via a die bond material (not shown). In device 10, wiring 63formed on front surface 60A of board 6 and light emitting element 1 areelectrically connected to light emitting element 1 by wire bonding usingmetal wire 12 as illustrated in FIG. 2. Light emitting element 1 isconstituted by a light emitting diode capable of emitting infraredlight. This light emitting diode is constituted by a semiconductor barechip. Light emitting element 1 emits infrared light having a wavelengtheasily absorbable by the detection target gas. Examples of the detectiontarget gas include carbon monoxide, carbon dioxide, methane, andnitrogen oxide. The structure of light emitting element 1 mounted onfirst recess 33 of support body 3 is capable of reducing mutual thermaleffect with respect to the signal processing circuit unit 7 sideprovided on board 6. Support body 3 is provided with second recesses 34at the other end of the one surface 30A side of support body 3 on theside opposite to the one end of support body 3. Light receiving elements2 are mounted on inner bottom surfaces of second recesses 34 of supportbody 3, respectively. According to device 10, light receiving elements 2are mounted on the inner bottom surfaces of second recesses 34 via a diebond material (not shown). In device 10, wire bonding using metal wire(not shown) electrically connects wiring 63 formed on front surface 60Aof board 6 to light receiving elements 2. Each of light receivingelements 2 includes an infrared sensor capable of receiving infraredlight. Each of the infrared sensors is constituted by a pyroelectricelement. Each of the infrared sensors is provided as a semiconductorbare chip. Support body 3 supports light emitting element 1 and lightreceiving elements 2 on the one surface 30A side with a predetermineddistance between light emitting element 1 and each of light receivingelements 2.

Support body 3 is provided with steps 32A formed in opposed inner wallsof each of second recesses 34. Optical filters 5 are disposed on thepair of steps 32A of support body 3, respectively, in such a state as tocover corresponding light receiving elements 2. Each of steps 32A has adepth in a direction of a thickness of support body 3 substantiallyequal to the thickness of each of optical filters 5. Each of opticalfilters 5 constitutes a band pass filter which has a transmission bandcontaining a predetermined wavelength band in wavelengths of infraredlight emitted from light emitting element 1.

Device 10 according to this exemplary embodiment is provided with thepair of second recesses 34 at the other end of support body 3 on the onesurface 30A side. Light receiving elements 2 are separately mounted onthe corresponding inner bottom surfaces of respective second recesses 34of support body 3. In device 10, optical filters 5 are separatelyequipped for corresponding light receiving elements 2 (hereinafterreferred to as first light receiving element 21 and second lightreceiving element 22 as well) in such a state as to cover the pair oflight receiving elements 2, respectively.

According to device 10 in this exemplary embodiment, one of opticalfilters 5 equipped for corresponding light receiving element 2constitutes first optical filter 51 which has a transmission bandcontaining a wavelength band of infrared light to be absorbed by thedetection target gas. According to device 10, the other of opticalfilters 5 equipped for corresponding light receiving element 2constitutes second optical filter 52 which does not have a transmissionband containing the wavelength band of the infrared light to be absorbedby the detection target gas, but has a transmission band containingwavelengths around the wavelength band of the infrared light to beabsorbed by the detection target gas.

Flat-plate-shaped reflection body 8 is mounted on the one surface 30Aside of support body 3. Reflection body 8 may be formed of a rectangularflat-plate-shaped plate material. Reflection body 8 has surface 80AA asa smooth surface capable of reflecting infrared light. As illustrated inFIG. 2, reflection body 8 includes rectangular main portion 80A, andprojecting portions 80B each having a rectangular shape smaller than theshape of main portion 80A, and projecting from both ends of main portion80A to the outside. Main portion 80A and projecting portions 80B areformed integrally with each other. Reflection body 8 is provided withfirst opening 81A through which infrared light emitted from lightemitting element 1 can pass at one end of main portion 80A. Reflectionbody 8 is provided with a pair of through holes 85A at the one end ofmain portion 80A with first opening 81A interposed between the pair ofthrough holes 85A. In addition, reflection body 8 is provided withsecond openings 82A through which infrared light receivable by lightreceiving elements 2 passes at other end of main portion 80A. Reflectionbody 8 is provided with through hole 85A in projection portion 80B atthe other end. Reflection body 8 closes opening 31A of frame-shapedsupport body 3. In other words, support body 3 has a frame-shapedexternal appearance. Support body 3 supports reflection body 8 whichreflects infrared light toward space 40A. Reflection body 8 coversopening 31A of frame-shaped support body 3.

Device 10 according to this exemplary embodiment includes optical member4 which covers one surface 30A of support body 3 where reflection body 8is disposed. Optical member 4 is a resin molded component constituted bya synthetic resin molded body. Optical member 4 includes metal portion44 (see FIG. 2) as gold-plated area throughout outside surface 40B ofoptical member 4. Optical member 4 constitutes a cover which covers theone surface 30A side of support body 3 where light emitting element 1and light receiving elements 2 are supported. Optical member 4 has arectangular parallelepiped shape which has an external sizesubstantially equal to an external size of support body 3 in a planview. Optical member 4 is provided with a recess opened to the supportbody 3 side. According to device 10, the recess of optical member 4forms space 40A into which the detection target gas is introducible.

As illustrated in FIG. 1, optical member 4 includes first optical pathchanging portion 41A which contains a first reflection mirror capable ofreflecting infrared light emitted from light emitting element 1 in apredetermined direction. Optical member 4 includes second optical pathchanging portion 41B which contains a second reflection mirror capableof reflecting the infrared light coming from the first optical pathchanging portion 41A side in a predetermined direction. Optical member 4further includes third optical path changing portion 41C which containsa third reflection mirror capable of guiding infrared light coming fromthe first optical path changing portion 41A side toward the secondoptical path changing portion 41B side. First optical path changingportion 41A includes a reflection surface having a parabolic shape.First optical path changing portion 41A changes a direction of anoptical path of infrared light emitted from light emitting element 1into the predetermined direction perpendicular to the direction of thethickness of the support body 3. Second optical path changing portion41B includes a reflection surface having a parabolic shape and facingthe reflection surface of first optical path changing portion 41A. Aftera change of the optical path of the infrared light by first optical pathchanging portion 41A, second optical path changing portion 41B changesthe direction of the infrared light into a direction crossing lightreceiving surfaces of light receiving elements 2. According to device10, optical member 4 changes the optical path of the infrared lightextending from light emitting element 1 toward light receiving elements2 into a C shape, as illustrated in FIG. 1. The structure of opticalmember 4 including first optical path changing portion 41A, secondoptical path changing portion 41B, and third optical path changingportion 41C allows infrared light emitted from light emitting element 1to travel toward the light receiving elements 2 side.

Optical member 4 is provided with rectangular air holes 42 each of whichpenetrates optical member 4 in a direction of a thickness of opticalmember 4. Optical member 4 can introduce the detection target gas intospace 40A through air holes 42. Optical member 4 is provided with dustfilter 11 on accommodation recess 42A so as to cover air holes 42 ofoptical member 4. Dust filter 11 prevents dust or other foreign materialfrom entering into air holes 42. Dust filter 11 is fixed toaccommodation recess 42A via not-shown adhesives. Optical member 4 hasrectangular parallelepiped projections 43 (see FIG. 2) projecting towardthe board 6 side at four corners of the rectangular shape of opticalmember 4, respectively. Support body 3 has engaging projections 35 (seeFIG. 2) projecting toward the optical member 4 side on one surface 30A.Each of engaging projections 35 includes a semispherical tip, and has acylindrical shape as the whole. Support body 3 has a pair of engagingprojections 35 projecting toward the optical member 4 side at the oneend of one surface 30A. The pair of engaging projections 35 are disposedwith light emitting element 1 interposed therebetween in the plan view.Support body 3 has one engaging projection 35 projecting toward theoptical member 4 side at a center of the other end of one surface 30A.Optical member 4 has engaging holes 45 (see FIG. 2) for engaging withengaging projections 35 of support body 3.

According to device 10, support body 3 and optical member 4 are capableof positioning with each other by engagement of engaging projections 35and engaging holes 45. In Device 10, engaging projections 35 andengaging holes 45 facilitate alignment between light emitting element 1and first optical path changing portion 41A, and alignment between lightreceiving elements 2 and second optical path changing portion 41B.According to device 10, engagement between support body 3 and opticalmember 4 is capable of positioning light emitting element 1 at a focusof the parabolic reflection surface of first optical path changingportion 41A. In device 10 according to this exemplary embodiment, it ispossible to position light receiving elements 2 at a focus of theparabolic reflection surface of second optical path changing portion 41Bby engagement between support body 3 and optical member 4.

According to device 10, optical member 4 is overlaid on board 6, withsupport body 3 interposed between optical member 4 and board 6, byinsertion of projections 43 of optical member 4 into insertion holes 62Aof board 6. In device 10, optical member 4 is fixed to board 6 viasupport body 3 in a state of insertion of projections 43 of opticalmember 4 into insertion holes 62A of board 6. According to device 10,support body 3 can be positioned with respect to reflection body 8 byinsertion of engaging projections 35 of support body 3 into throughholes 85A of reflection body 8. In device 10, engaging projections 35and through holes 85A facilitate alignment between light emittingelement 1 and first opening 81A. In device 10, engaging projections 35and through holes 85A facilitate alignment between light receivingelements 2 and second openings 82A. Device 10 allows infrared lightemitted from light emitting element 1 to pass through first opening 81Aby positioning reflection body 8 on support body 3. Device 10 accordingto this exemplary embodiment allows light receiving elements 2 toreceive infrared light passing through second openings 82A bypositioning reflection body 8 on support body 3.

Device 10 introduces the outside air into space 40A surrounded byoptical member 4 and reflection body 8 via air holes 42. According todevice 10, an amount of infrared light transmitted through first opticalfilter 51 and received by first light receiving element 21 decreaseswith respect to that of infrared light emitted from light emittingelement 1 in accordance with a concentration of the detection targetgas. According to device 10, when the concentration of the detectiontarget gas is low, an amount of infrared light received by first lightreceiving element 21 becomes close to the amount of infrared lightemitted from light emitting element 1. When the concentration of thedetection target gas is high, the amount of infrared light received byfirst light receiving element 21 decreases. According to device 10, anamount of infrared light transmitted through second optical filter 52and received by second light receiving element 22 does not vary inaccordance with the concentration of the detection target gas.

In device 10, signal processing circuit unit 7 processes a signalindicating an amount of received infrared light and output from lightreceiving elements 2. Device 10 is capable of detecting a concentrationof a gas component of the detection target gas contained in space 40Asurrounded by optical member 4 and reflection body 8.

According to device 10 in this exemplary embodiment, signal processingcircuit unit 7 calculates a concentration of the detection target gasbased on a difference between output signal levels output from the pairof light receiving elements 2. Signal processing circuit unit 7 obtainsthe difference between the output signal levels output from first lightreceiving element 21 and second light receiving element 22, andcalculates the concentration of the detection target gas based on thisdifference.

According to device 10, signal processing circuit unit 7 calculates theconcentration of the detection target gas based on the differencebetween the output signal levels output from first light receivingelement 21 and second light receiving element 22. Device 10 is capableof canceling variations of respective output signal levels output fromlight receiving elements 2 based on the difference between the outputsignal levels from first light receiving element 21 and second lightreceiving element 22, so as to prevent lowering of detection accuracy atthe time of detection of a concentration of a gas.

When signal processing circuit unit 7 of device 10 calculates aconcentration of a gas based only on an output signal level output fromone of light receiving elements 2, detection accuracy at the time ofdetection of the concentration of the gas may lower due to a variationof the output signal level from light receiving element 2 caused by somedisturbance factor. However, when signal processing circuit unit 7 ofdevice 10 according to this exemplary embodiment calculates theconcentration of the detection target gas based on a difference betweenoutput signal levels output from the pair of light receiving elements 2,it is possible to suppress lowering of detection accuracy at the time ofdetection of the concentration of the gas by canceling variations of theoutput signal levels from respective light receiving elements 2.

According to device 10 in this exemplary embodiment, board 6 hasconductor wiring 61 for outputting signals from light receiving elements2 to the outside and wiring 63 electrically connected to conductorwiring 61. Conductor wiring 61 is electrically connected to wiring 63formed on front surface 60A of board 6. Board 6 is provided with throughholes 61A (see FIG. 2) into which metal terminals 65 (see FIGS. 3 and 4)can be inserted. Terminals 65 are provided for outputting signalsreceived from light receiving elements 2. In board 6, metal terminals 65inserted into through holes 61A are electrically connected to conductorwiring 61 via not-shown soldering or the like.

According to device 10 of this exemplary embodiment, device 10 ofdifferent mount configuration can be manufactured only by replacingboard 6 containing conductor wiring 61 with board 6 having a differentconfiguration.

This structure allows standardization of components constituting device10, and increases a degree of freedom for electric connection betweendevice 10 and an external apparatus provided outside device 10 for eachtype of apparatuses on which device 10 of this exemplary embodiment ismounted.

A method for manufacturing device 10 according to this exemplaryembodiment is hereinafter described with reference to FIGS. 1 through 9.

According to the method for manufacturing device 10, electronic parts 71are mounted on board 6. According to the method for manufacturing device10, electronic parts 71 constituting signal processing circuit unit 7are soldered to wiring 63 of board 6 by flow soldering or other methods.Frame-shaped support body 3 is positioned on board 6 so as to surroundan area where electronic parts 71 are mounted. Light emitting element 1and light receiving elements 2 may be mounted on the one surface 30Aside of support body 3 in advance. According to the method formanufacturing device 10, support body 3 and board 6 are aligned byinsertion of projections (not shown) projecting from support body 3toward the board 6 side into holes 63A (see FIG. 3) of board 6.

When an automatic assembling device (not shown) is used in the methodfor manufacturing device 10, mounting positions of light emissionelement 1 and light receiving elements 2 are determined by performing animaging process (such as edge detection) for an image of support body 3imaged by an imaging device of the automatic assembling device. Indevice 10, cross-shaped groove 33A (see FIG. 2) is formed in an innerbottom surface of first recess 33 of support body 3. According to themethod for manufacturing device 10, the mounting position of lightemitting element 1 may be determined with reference to an edge of groove33A. According to device 10, cross-shaped groove 34A is formed in eachinner bottom surface of second recesses 34 of support body 3. Accordingto device 10, each of the mounting positions of light receiving elements2 may be determined with reference to an edge of corresponding groove34A. According to the method for manufacturing device 10, light emittingelement 1 is mounted on the inner bottom surface of first recess 33 ofsupport body 3 via a die bond material such as epoxy resin. Similarly,according to the method for manufacturing device 10, light receivingelements 2 are mounted on the inner bottom surfaces of second recesses34 of support body 3 via die bond materials such as epoxy resin,respectively. According to the method for manufacturing device 10, metalwire 12 electrically connect the wiring 63 side formed on front surface60A of board 6 to light emitting element 1. According to the method formanufacturing device 10, wiring 63 formed on front surface 60A of board6 is electrically connected to light receiving elements 2 by wirebonding using metal wire. According to the method for manufacturingdevice 10, optical filters 5 are disposed on the pair of steps 32Aformed in the inner walls of each of second recesses 34 of support body3 in such a condition that optical filters 5 cover corresponding lightreceiving elements 2 (see FIG. 5).

According to the method for manufacturing device 10, next, reflectionbody 8 is positioned on support body 3 on which optical filters 5 aredisposed (see FIG. 6). According to the method for manufacturing device10, support body 3 and reflection body 8 are aligned by insertion ofengagement projections 35 projecting from support body 3 toward theoptical member 4 side into through holes 85A of reflection body 8.According to the method for manufacturing device 10, first opening 81Aand light emitting element 1 can be aligned by alignment between supportbody 3 and reflection body 8. In addition, according to the method formanufacturing device 10, second openings 82A and light receivingelements 2 can be aligned by alignment between support body 3 andreflection body 8.

Subsequently, according to the method for manufacturing device 10,projections 43 projecting from optical member 4 toward the board 6 sideare inserted into insertion holes 62A of board 6 (see FIGS. 7 and 8), sothat optical member 4 is overlaid on board 6 with support body 3interposed therebetween. According to the method for manufacturingdevice 10, projections 43 of optical member 4 are joined to lands 62formed around insertion holes 62A by soldering. In device 10,projections 43 of optical member 4 are joined to lands 62 aroundinsertion holes 62A by soldering 13 (see FIG. 9). FIG. 1 is a viewillustrating a cross section taken along a 1-1 plane in FIG. 9.

In device 10, optical member 4 having outside surface 40B coated withmetal material is electrically connected with lands 62 around insertionholes 62A of board 6. In device 10, lands 62 around insertion holes 62Aof board 6 are grounded. In other words, optical member 4 is a resinmolded component whose outside surface 40B is coated with metal portion44 made of metal material which is electrically connected to the groundof board 6.

According to device 10, a potential of optical member 4 coated withmetal portion 44 of metal material may be set to a reference potential.In this case, device 10 can prevent generation of noise in electronicparts 71 or the like provided on board 6 covered by optical member 4.The noise may result from entrance of electromagnetic waves from theoutside of device 10. Similarly, according to device 10, a potential ofreflection body 8 contacting optical member 4 is allowed to be set tothe reference potential in accordance with setting of the potential ofoptical member 4 coated with metal portion 44 of metal to the referencepotential. By setting the potential of reflection body 8 to thereference potential, in device 10, it can be further suppress togenerate noise in electronic parts 71 or the like provided on board 6covered by reflection body 8. The noise may result from entrance ofelectromagnetic waves from the outside of device 10.

According to device 10 in this exemplary embodiment, metal terminals 65are inserted into through holes 61A of board 6. According to device 10,conductor wiring 61 formed around through holes 61A of board 6 iselectrically connectable to metal terminals 65 via soldering (not shown)or the like. Device 10 is electrically connectable with an externalapparatus via metal terminals 65. According to device 10, patterns ofconductor wiring 61 formed on board 6 are allowed to vary relativelyeasily in comparison with a device which has terminals formed by insertmolding of resin material, for outputting signals received from lightreceiving elements 2 to the outside. Device 10 preferably includes screwholes 60C for receiving screws or the like fixing device 10 to a wiringboard (not shown) of an external apparatus.

In device 10 according to this exemplary embodiment, optical member 4 isoptically coupled with support body 3 on which light emitting element 1and light receiving elements 2 are mounted as elements requiringrelatively high alignment accuracy. In addition, in device 10, opticalmember 4 is fixed to board 6 which does not require relatively highalignment accuracy with support body 3 and optical member 4 incomparison with the optical coupling. According to device 10, conductorwiring 61 for outputting signals received from the light receivingelements 2 side to the outside is provided on board 6 which does notrequire relatively high alignment accuracy, and therefore a degree offreedom of electric connection to the outside further can increase. Inother words, in device 10 according to this exemplary embodiment,support body 3 which holds light emitting element 1 and light receivingelements 2 with a predetermined distance therebetween is functionallyseparated from board 6 which includes conductor wiring 61 for outputtingsignals to the outside, in accordance with accuracy of alignment.

Device 10 according to this exemplary embodiment is applicable to a gassensor equipped on an air conditioner, a gas detection alarm, a vehicleexhaust gas measuring device, alcohol detector or the like, for example.

The respective components included in device 10 according to thisexemplary embodiment are hereinafter described in more detail.

Light emitting element 1 is capable of emitting infrared light. Lightemitting element 1 may be constituted by a semiconductor bare chip.Light emitting element 1 is not limited to a semiconductor bare chip,but may be a chip size package. Light emitting element 1 may beconstituted by a light emitting diode chip, or a resistance element or alaser diode provided on a semiconductor substrate, for example. Lightemitting element 1 is capable of emitting infrared light having awavelength easily absorbable by a detection target gas. Light emittingelement 1 can be electrically connected to wiring 63 formed on board 6by an appropriate method such as wire bonding. Reduction of the entiresize of device 10 is achievable when light emitting element 1 isconstituted by a semiconductor bare chip, in comparison with a devicewhich uses a package type light emitting diode.

Light receiving elements 2 are capable of receiving infrared light andconverting the infrared light into electric signals. Light receivingelements 2 may be constituted by semiconductor bare chips. Lightreceiving elements 2 are not limited to semiconductor bare chips, butmay be chip size packages. Light receiving elements 2 may be constitutedby pyroelectric elements or photodiode chips, for example. Lightreceiving elements 2 can be electrically connected to wiring 63 formedon board 6 by an appropriate method such as wire bonding. Reduction ofthe entire size of device 10 is achievable when light receiving elements2 are constituted by semiconductor bare chips, in comparison with adevice which uses package type photodiodes.

Support body 3 is capable of supporting light emitting element 1 andlight receiving elements 2 with a predetermined distance therebetween.Support body 3 may have a frame-shaped external appearance. Support body3 is capable of accommodating electronic parts 71 mounted on board 6within opening 31A of frame-shaped support body 3. Support body 3 may bea resin molded component formed by a synthetic resin molded body.Support body 3 may be made of polyphthalamide resin, for example.Support body 3 has steps 32A on which optical filters 5 can bepositioned so as to cover light receiving elements 2. To support body 3,reflection body 8 may be positioned in such a manner to cover opening31A of frame-shaped support body 3. Reflection body 8 may be providedwith a fourth optical path changing portion corresponding to areflection mirror which reflects infrared light so as to guide the lightfrom the first optical path changing portion 41A side to the secondoptical path changing portion 41B side. Reflection body 8 is capable ofclosing a part of opening 31A of frame-shaped support body 3. Supportbody 3 is capable of increasing light utilization efficiency by coveringopening 31A of frame-shaped support body 3 and supporting reflectionbody 8 which reflects infrared light toward space 40A.

Optical member 4 is capable of guiding infrared light from lightemitting element 1 toward light receiving elements 2. Optical member 4is capable of covering one surface 30A side of support body 3 withinterposed therebetween. The detection target gas is introducible intospace 40A. Optical member 4 may be a resin molded component formed by asynthetic resin molded body. Optical member 4 may be made ofpolyphthalamide resin, for example. Optical member 4 is not limited to aresin molded component, but may be made of metal material. Opticalmember 4 constituted by a resin molded component has a more accurateexternal appearance than a component made of metal material. It ispreferable that outside surface 40B of optical member 4 is coated withmetal material when optical member 4 is formed as a resin moldedcomponent. Optical member 4 may have a rectangular parallelepiped shapehaving an external size equivalent to the external size of support body3 in the plan view. Optical member 4 is allowed to be fixed to board 6in such a manner that a recess of optical member 4 faces board 6 viasupport body 3. Optical member 4 may have air holes 42 penetratingoptical member 4 in the direction of the thickness of optical member 4.Optical member 4 is capable of introducing and discharging the detectiontarget gas into and out of space 40A through air holes 42. It ispreferable that air holes 42 of optical member 4 are covered by dustfilters 11 to prevent entrance of foreign material other than theoutside air, such as dust, into air holes 42. Each of air holes 42 mayhave a rectangular shape in the plan view, for example. Each shape ofair holes 42 is not limited to a rectangular shape, but may have othershapes such as a circular shape in the plan view. The number of airholes 42 is not required to be two. The number of air holes 42 may beone, three or a larger number.

Optical member 4 may include the first reflection mirror constitutingfirst optical path changing portion 41A, the second reflection mirrorconstituting second optical path changing portion 41B, and the thirdreflection mirror constituting third optical path changing portion 41C.Optical member 4 may include metal material such as gold and aluminumformed by deposition or plating on the inner surface of the recess ofoptical member 4. Third optical path changing portion 41C may have asemi-cylindrical shape at both ends of which first optical path changingportion 41A and second optical path changing portion 41B are provided.

The reflection surface of first optical path changing portion 41A is notlimited to a parabolic surface. First optical path changing portion 41Amay have a reflection surface having a flat shape, a spherical shape, ora polygonal shape. The reflection surface of second optical pathchanging portion 41B is not limited to a parabolic surface. Secondoptical path changing portion 41B may have a reflection surface having aflat shape, a spherical shape, or a polygonal shape. When the reflectionsurface of second optical path changing portion 41B of device 10 is madeto be a concave surface, light reflected on the reflection surface ofsecond optical path changing portion 41B is allowed to be converged. Inthis case, light receiving elements 2 can efficiently receive infraredlight.

Each of optical filters 5 is capable of transmitting infrared lighthaving a predetermined wavelength band. Each of optical filters 5constitutes a band pass filter which has a transmission band containinga wavelength band of a wavelength of infrared light emitted from lightemitting element 1. Each of optical filters 5 may be formed of aninterference filter having a multilayered structure of dielectric films,for example. Examples of a base material of each of optical filters 5include Ge, Si and other semiconductor materials, and methacrylic resin.Optical filters 5 may be disposed on steps 32A of support body 3.Optical filters 5 may be fixed to steps 32A of support body 3 viabonding material (not shown). Optical filters 5 may be fixed toreflection body 8 via bonding material. Optical filters 5 may be fixedto light receiving elements 2 via bonding material. The bonding materialemployed herein may be made of glass having a low melting point, alloyhaving a low melting point, and resin material, for example. Accordingto device 10 in this exemplary embodiment, optical filters 5 may beprovided on optical member 4 between first optical path changing portion41A and second optical path changing portion 41B as illustrated in FIG.10. In other words, optical filters 5 are only required to be disposedon the optical path of infrared light from light emitting element 1toward the light receiving elements 2 side.

Board 6 can be coupled with optical member 4 via support body 3. Board 6may have a rectangular flat-plate external shape, for example. The shapeof board 6 is not limited to a rectangular flat-plate shape, but may bevarious shapes such as a circular shape and a polygonal shape. Board 6may be formed of a glass epoxy resin substrate, or a ceramicmulti-layered substrate, for example. Electronic parts 71 constitutingsignal processing circuit unit 7 may be mounted on board 6, for example.Board 6 includes wiring 63. Board 6 includes conductor wiring 61 capableof being electrically connected to wiring 63. Conductor wiring 61 iscapable of being electrically connected to light receiving elements 2and electronic parts 71 constituting signal processing circuit unit 7 byusing wiring 63, so as to output signals from light receiving elements2.

Board 6 is provided with through holes 61A penetrating board 6. In board6, conductor wiring 61 around through holes 61A is capable of beingelectrically connected, via soldering (not shown) or the like, to metalterminals 65 by inserting metal terminals 65 into through holes 61A.Device 10 is allowed to be mounted on a wiring board (not shown) of anexternal apparatus by use of metal terminals 65. Similarly, device 10including board 6 as illustrated in FIG. 11 is allowed to includereceptacle 66 which contains contact pins 68 within connector body 67formed by insulation material (see FIG. 12), instead of the use of metalterminals 65. In device 10, contact pins 68 of receptacle 66 areelectrically connected to conductor wiring 61. According to device 10,conductor wiring 61 is capable of being electrically connected, viareceptacle 66, to a plug electrically connected with a wiring board onthe apparatus side. Alternatively, surface mounting type receptacle 69may be surface-mounted on conductor wiring 61 via soldering or the like,instead of the use of metal terminals 65 as in device 10 including board6 as illustrated in FIG. 13 (see FIG. 14). Device 10 is capable of beingelectrically connected to the wiring board on the apparatus side byusing metal terminals 65, receptacle 66, or receptacle 69.

Signal processing circuit unit 7 is configured to allow emission ofinfrared light from light emitting element 1 by controlling lightemitting element 1. Signal processing circuit unit 7 is configured toprocess signals output from light receiving elements 2 upon receivinginfrared light. Signal processing circuit unit 7 may perform signalprocessing such as amplification, waveform shaping, signal sampling, andsignal A/D conversion of signals output from light receiving elements 2.Signal processing circuit unit 7 may further perform signal processingsuch as signal calculation, signal correction, and determination thatthe detection target gas has an abnormal concentration, for example.Signal processing circuit unit 7 may be formed of electronic parts 71such as integrated circuits.

Reflection body 8 is capable of reflecting infrared light toward space40A. Reflection body 8 may be a flat-shaped plate component made ofmetal material. Examples of material of reflection body 8 include metalmaterial such as aluminum. Reflection body 8 is made of metal, andelectrically connectable with metal portion 44 made of metal as aportion of optical member 4. Reflection body 8 may include the fourthoptical path changing portion capable of reflecting infrared light, andhaving a smooth surface on the side facing optical member 4. Reflectionbody 8 is not required to be made of metal material, but may be formedof a resin molded component. Reflection body 8 may be aflat-plate-shaped member formed of a resin molded component on whichgold, aluminum or other metal material is deposited or plated.

Second Exemplary Embodiment

Device 10 according to this exemplary embodiment illustrated in FIG. 15is different from device 10 in the first exemplary embodiment chiefly inthat cover member 9 closing first opening 81A is provided at firstopening 81A of reflection body 8 in the first exemplary embodimentillustrated in FIG. 1. Constituent elements similar to correspondingconstituent elements in the first exemplary embodiment are given similarreference numbers, and the same explanation is not repeated whenomission of the explanation is appropriate.

According to device 10 in this exemplary embodiment illustrated in FIGS.15 and 16, reflection body 8 includes first opening 81A through whichinfrared light emitted from light emitting element 1 passes. Reflectionbody 8 includes second openings 82A through which infrared light to bereceived by light receiving elements 2 passes. In device 10, translucentcover member 9 closes first opening 81A. In device 10, optical filters 5close second openings 82A, respectively. Translucent cover member 9 andoptical filters 5 prevent air from flowing toward the light receivingelements 2 side from space 40A surrounded by reflection body 8, covermember 9, optical filters 5, and optical member 4. Optical filters 5 areconsidered to have translucency. Accordingly, cover member 9 isconsidered as a first translucent cover member, while optical filters 5are considered as second translucent cover members.

While a configuration of each of light receiving elements 2 of device 10is not shown in this exemplary embodiment, each of light receivingelements 2 may be constituted by a pyroelectric infrared sensorincluding a membrane formed of an insulation film on a cavity portion,and containing a pyroelectric element which includes a pyroelectricmaterial sandwiched between electrodes on the insulation film, forexample. This infrared sensor may be formed in an appropriate manner byusing MEMS (Micro Electro Mechanical Systems) technology, for example.

According to device 10 in the first exemplary embodiment, there is apossibility that a detection target gas flows from the space 40A sidetoward the light receiving elements 2 side via first opening 81A. Inaddition, according to device 10, there is a possibility that a membraneof an infrared sensor is deformed by flow and pressure of the detectiontarget gas from the space 40A side toward the light receiving elements 2side. There is a possibility in device 10 that detection errors of theinfrared sensor, or damage to the infrared sensor are caused when themembrane of the infrared sensor is deformed.

As device 10 in this exemplary embodiment includes optical filters 5,detection errors of the infrared sensor and damage to the infraredsensor caused by pressure of the detection target gas are suppressedeven when each of light receiving elements 2 includes an infrared sensorcontaining a membrane.

Third Exemplary Embodiment

Device 10 according to this exemplary embodiment is different fromdevice 10 according to the first exemplary embodiment in that three ormore sets of optical filter 5 and light receiving element 2 are providedfor one light emitting element 1, instead of two sets of optical filter5 and light receiving element 2 for one light emitting element 1 as inthe first exemplary embodiment illustrated in FIG. 1. Constituentelements similar to corresponding constituent elements in the firstexemplary embodiment are given similar reference numbers, and the sameexplanation is not repeated when omission of the explanation isappropriate.

According to device 10 in this exemplary embodiment, optical filters 5include first optical filter 51 which has a transmission band containinginfrared light in a wavelength band absorbable by a detection targetgas, and second optical filter 52 which has a transmission banddifferent from that of first optical filter 51, as illustrated in FIGS.17 and 18. Light receiving elements 2 include first light receivingelement 21 which photoelectrically converts infrared light transmittedthrough first optical filter 51, and second light receiving element 22which photoelectrically converts infrared light transmitted throughsecond optical filter 52. Optical filters 5 further include thirdoptical filter 53 which has a transmission band different from those offirst optical filter 51 and second optical filter 52. Light receivingelements 2 further include third light receiving element 23 whichphotoelectrically converts infrared light transmitted through thirdoptical filter 53.

This structure allows device 10 according to this exemplary embodimentto detect various types of gases. While device 10 according to the firstexemplary embodiment is an example of a gas sensor for detecting aconcentration of one type of gas contained in the outside air, device 10including a plurality of sets of light receiving element 2 and opticalfilter 5 can detect concentrations of gases of different types for eachset of light receiving element 2 and optical filter 5. Device 10according to this exemplary embodiment includes three or more sets oflight receiving element 2 and optical filter 5, and is thus capable ofdetecting concentrations of gases of different types based on outputsfrom respective light receiving elements 2.

Device 10 according to this exemplary embodiment includes first lightreceiving element 21 as light receiving element 2 for gas detection.Device 10 includes second light receiving element 22 as light receivingelement 2 for gas detection. In device 10 in this exemplary embodiment,each of optical filters 5 constitutes a band pass filter which has atransmission band containing a wavelength corresponding to absorptioncharacteristics of the detection target gas. Device 10 including aplurality of sets of light receiving element 2 for gas detection andoptical filter 5 according to this embodiment is capable of detecting aplurality kind of gases. Device 10 according to this exemplaryembodiment is capable of independently detecting concentrations of twodifferent types of gases from a plurality of types of gases contained inthe outside air. Device 10 according to this exemplary embodiment iscapable of simultaneously detecting both of a first gas (such as carbonmonoxide) and a second gas (such as nitrogen oxide) of two types ofgases. Moreover, device 10 according to this exemplary embodimentincludes third optical filter 53 which transmits a band not absorbed byeither the first gas or the second gas. Third light receiving element 23receives infrared light transmitted through third optical filter 53, andoutputs a signal generated by photoelectric conversion to signalprocessing circuit unit 7. Signal processing circuit unit 7 measures achange ratio from initial output from light emitting element 1 based onthe signal output from third light receiving element 23. According todevice 10, signal processing circuit unit 7 having measured the changeratio from the initial output from light emitting element 1 correctsoutput from first light receiving element 21 and output from secondlight receiving element 22. Device 10 is capable of avoiding the effectby power deterioration of light emitting element 1 or the like, andimproving measurement accuracy by correcting outputs from first lightemitting element 21 and second light emitting element 22.

Fourth Exemplary Embodiment

Device 110 according to this exemplary embodiment is hereinafterdescribed with reference to FIGS. 19A through 22.

FIGS. 19A and 19B are cross-sectional views schematically illustratingdevice 10 according to a fourth exemplary embodiment, while FIG. 20 is aplan view illustrating an essential part of device 10 of the fourthexemplary embodiment. Device 110 according to this exemplary embodimentis a gas detecting device. Device 110 includes light emitting element101, light receiving elements 102, signal processing circuit unit 107,optical member 104, and board 106. Signal processing circuit unit 107processes signals output from light receiving elements 102. Opticalmember 104 covers light emitting element 101 and light receivingelements 102. Light emitting element 101, light receiving elements 102,signal processing circuit unit 107, and optical member 104 are mountedon board 106. Board 106 includes conductor wiring 161 electricallyconnected to light receiving elements 102 (see FIG. 21).

This structure increases a degree of freedom for electric connectionbetween device 110 according to this exemplary embodiment and theoutside.

Device 110 according to this exemplary embodiment includes lightemitting element 101 for emitting infrared light (see FIG. 19A) andlight receiving elements 102 for photoelectrically converting infraredlight (see FIG. 19B). Device 110 includes support body 103 supportinglight emitting element 101 and light receiving elements 102. Device 110includes optical member 104 for guiding infrared light emitted fromlight emitting element 101 toward light receiving elements 102. Device110 includes optical filters 105 disposed on optical paths (see arrowsin FIG. 19A and FIG. 19B) for guiding infrared light from light emittingelement 101 toward the light receiving elements 102 side. FIG. 19A is across-sectional view of device 110 illustrating a cross section takenalong a line 19A-19A in FIG. 20. FIG. 19B is a cross-sectional view ofdevice 110 illustrating a cross section taken along a line 19B-19B inFIG. 20.

In device 110, light emitting element 101 and light receiving elements102 are disposed at one end of support body 103 on one surface 130A sideof support body 103. Optical member 104 covers the one surface 130A sideof support body 103 with space 140A interposed therebetween. A detectiontarget gas is introducible into space 140A. Optical member 104 includesreflection mirror 141AB disposed at the other end of support body 103 onthe side opposite to the one side of support body 103 to reflectinfrared light emitted from light emitting element 101 disposed at theone side of support body 103 and guide the infrared light toward lightreceiving elements 102 disposed at the one end of support body 103.

This structure further reduces the size of device 110 in this exemplaryembodiment.

A more specific configuration of device 110 according to this exemplaryembodiment is hereinafter described.

In device 110 according to this exemplary embodiment, support body 103is disposed on board 106. Support body 103 has a trapezoidal frame-likeexternal shape in the plan view (see FIG. 21). Support body 103 isconstituted by a resin molded component formed of a synthetic resinmolded body. Board 106 has a rectangular flat-plate shape larger thanthe shape of support body 103. Board 106 is formed of a glass epoxyresin substrate. Board 106 has wiring of conductor patterns (not shown)on front surface 160A thereof. Board 106 includes rear surface 160Bopposite to front surface 160A. According to device 110, electronicparts 171 are mounted on front surface 160A of board 106. Electronicpart 171 is electrically connected with wiring via soldering (notshown). While only one electronic part 171 is shown in the figureaccording to device 110 in this exemplary embodiment, a plurality ofelectronic parts 171 may be mounted on board 106. Such a plurality ofelectronic parts 171 may be electrically connected with each other viawiring provided on board 106. Electronic part 171 constitutes signalprocessing circuit unit 107. According to device 110, signal processingcircuit unit 107 may be constituted by a plurality of electronic parts171. Signal processing circuit unit 107 is configured to allow emissionof infrared light from light emitting element 101 by controlling lightemitting element 101. Signal processing circuit unit 107 is configuredto process signals output from light receiving elements 102 uponreceiving infrared light. Signal processing circuit unit 107 performssignal processing such as amplification, waveform shaping, signalsampling, and signal analog/digital conversion of the signals outputfrom light receiving elements 102. Signal processing circuit unit 107further performs signal processing such as signal calculation, signalcorrection, and determination that the detection target gas has anabnormal concentration, for example. In device 110, signal processingcircuit unit 107 is disposed within opening 131A of frame-shaped supportbody 103. In other words, electronic part 171 for processing signalsoutput from light receiving elements 102 is mounted on board 106.According to device 110 structured such that electronic part 171constituting signal processing circuit unit 107 is contained in opening131A of frame-shaped support body 103, reduction of the entire size ofdevice 110 is achievable.

In device 110, front surface 160A of board 106 is exposed to an insideof opening 131A of frame-shaped support body 103. Support body 103 isprovided with first recess 133 at the one end of support body 103 on theone surface 130A side. Light emitting element 101 is mounted on an innerbottom surface of first recess 133 of support body 103. In device 110,light emitting element 101 is mounted on the inner bottom surface offirst recess 133 via a die bond material (not shown). In device 110, thewiring formed on front surface 160A of board 106 and light emittingelement 101 are electrically connected to each other by wire bondingusing metal wire (not shown), for example. Light emitting element 101 isconstituted by a light emitting diode capable of emitting infraredlight. This light emitting diode is constituted by a semiconductor barechip. Light emitting element 101 emits infrared light having awavelength easily absorbed by a detection target gas. Examples of thedetection target gas include carbon monoxide, carbon dioxide, methane,and nitrogen oxide. The structure of light emitting element 101 mountedon the inner bottom surface of first recess 133 of support body 103 iscapable of reducing mutual thermal effect between light emitting element101 and the signal processing circuit unit 107 side provided on board106. Support body 103 is provided with second recesses 134 at the oneend of support body 103 on the one surface 130A side. Light receivingelements 102 are mounted on inner bottom surfaces of second recesses 134of support body 103, respectively. In device 110, light receivingelements 102 are mounted on the inner bottom surfaces of second recesses134 via die bond materials (not shown). In Device 110, the wiring formedon front surface 160A of board 106 and light receiving elements 102 areelectrically connected to each other by wire bonding using metal wire(not shown). Each of light receiving elements 102 includes an infraredsensor capable of receiving infrared light. Each of the infrared sensorsis constituted by a pyroelectric element. Each of the infrared sensorsis provided as a semiconductor bare chip. Support body 103 supportslight emitting element 101 and light receiving elements 102 on the onesurface 130A side.

Support body 103 has first steps 132A in opposed inner walls of firstrecess 133 (see FIG. 21). Cover member 109 is disposed on the pair offirst steps 132A of support body 103 so as to cover light emittingelement 101. First steps 132A are so sized that a depth of each thereofin a direction of a thickness of support body 103 is substantially equalto a thickness of cover member 109.

Support body 103 has second steps 132B in opposed inner walls of each ofsecond recesses 134 (see FIG. 21). Optical filter 105 is disposed oneach of the pair of second steps 132B of support body 103 so as to coverlight receiving elements 102. Second steps 132B are so sized that eachdepth thereof in the direction of the thickness of support body 103 issubstantially equal to the thickness of each of optical filters 105.Each of optical filters 105 is capable of constituting a band passfilter which has a transmission band containing a predeterminedwavelength band in wavelengths of infrared light emitted from lightemitting element 101.

In device 110 according to this exemplary embodiment, support body 103is provided with the pair of second recesses 134 at the one end thereofon the one surface 130A side (see FIG. 21). Light receiving elements 102are separately mounted on the inner bottom surfaces of second recesses134 of support body 103, respectively. In device 110, optical filters105 are separately disposed on corresponding light receiving elements102 so as to cover the pair of light receiving elements 102.Hereinafter, the pair of light receiving elements 102 are referred to asfirst light receiving element 121 and second light receiving element 122as well.

According to device 110 in this exemplary embodiment, one of opticalfilters 105 provided separately on corresponding light receivingelements 102 constitutes first optical filter 151 which has atransmission band containing a wavelength band of infrared light to beabsorbed by the detection target gas. According to device 110, the otherof optical filters 105 provided separately on corresponding lightreceiving elements 102 constitutes second optical filter 152 which doesnot have a transmission band containing the wavelength band of theinfrared light to be absorbed by the detection target gas, but has atransmission band containing wavelengths around the wavelength band ofthe infrared light to be absorbed by the detection target gas.

In device 110 according to this exemplary embodiment, light emittingelement 101, second light receiving element 122, and first lightreceiving element 121 are disposed on support body 103 in this order inthe plan view.

Flat-plate-shaped reflection body 108 is mounted on the one surface 130Aside of support body 103. Reflection body 108 may be formed of atrapezoidal flat-plate-shaped plate member in the plan view (see FIG.22). Reflection body 108 includes surface 180AA formed into a smoothsurface capable of reflecting infrared light. Reflection body 108 hasfirst opening 181A through which infrared light emitted from lightemitting element 101 can pass at one end thereof. Reflection body 108 isprovided with through holes 185A at both ends of reflection body 108 onthe one end side of reflection body 108. In addition, reflection body108 has second openings 182A through which infrared light receivable bylight receiving elements 102 passes at the one end of reflection body108. Through hole 185A is formed at a center of the other end ofreflection body 108. Reflection body 108 closes opening 131A offrame-shaped support body 103. In other words, support body 103 has aframe-shaped external appearance, and supports reflection body 108 whichcovers opening 131A of frame-shaped support body 103 and reflectsinfrared light toward space 140A.

Device 110 according to this exemplary embodiment includes opticalmember 104 covering one surface 130A of support body 103 on whichreflection body 108 is mounted. Optical member 104 is a resin moldedcomponent formed of a synthetic resin molded body. Optical member 104includes a metal portion (not shown) formed throughout outside surface140B thereof by gold-plating. Optical member 104 constitutes a coverwhich covers the one surface 130A side of support body 103 supportinglight emitting element 101 and light receiving elements 102. Opticalmember 104 has a trapezoidal shape which has an external sizesubstantially equal to that of support body 103. Optical member 104 isprovided with a recess opened to the support body 103 side. According todevice 110, the recess of optical member 104 forms space 140A into whichthe detection target gas is introducible.

As illustrated in FIG. 19A, optical member 104 includes first reflectionmirror 141AA disposed at the one end of support body 103 for reflectinginfrared light emitted from light emitting element 101 in apredetermined direction. First reflection mirror 141AA constitutes afirst optical path changing portion of optical member 104. Opticalmember 104 includes reflection mirror 141AB as a second reflectionmirror disposed at the other end of support body 103 for reflectingagain the infrared light coming from the first reflection mirror 141AAside toward the one end side of support body 103. Reflection mirror141AB as the second reflection mirror constitutes a second optical pathchanging portion of optical member 104. Optical member 104 includesthird reflection mirror 141BA disposed at the one end side of supportbody 103 for reflecting the infrared light coming from reflection mirror141AB in a predetermined direction as illustrated in FIG. 19B. Thirdreflection mirror 141BA constitutes a third optical path changingportion of optical member 104. Optical member 104 includes fourthreflection mirror 141C disposed on a bottom surface of the recess ofoptical member 104 and capable of reflecting and guiding infrared lightfrom the first reflection mirror 141AA side toward the third reflectionmirror 141BA side via reflection mirror 141AB. Fourth reflection mirror141C constitutes a fourth optical path changing portion of opticalmember 104.

First reflection mirror 141AA may include a reflection surface having aparabolic shape. First reflection mirror 141AA changes the direction ofthe optical path of infrared light emitted from light emitting element101 into the predetermined direction perpendicular to the direction ofthe thickness of support body 103. Reflection mirror 141AB as the secondreflection mirror faces first reflection mirror 141AA, and may include areflection surface having a smooth and flat shape. Third reflectionmirror 141BA changes the direction of the optical path of the infraredlight of which optical path is changed by first reflection mirror 141AAand reflection mirror 141AB into a direction crossing light receivingsurfaces of light receiving elements 102. Optical member 104 includesthird reflection mirror 141BB in correspondence with second lightreceiving element 122 similarly to third reflection mirror 141BAprovided in correspondence with first light receiving element 121 (seeFIG. 20). According to device 110, optical member 104 changes theoptical path of the infrared light extending from light emitting element101 to light receiving elements 102 (see broken lines in FIG. 23) into aV shape as illustrated in FIG. 23.

Device 110 in this exemplary embodiment can be smaller in comparisonwith a device in an example which does not include optical member 104containing reflection mirror 141AB, but includes an optical memberforming an optical path for linear emission of infrared light from lightemitting element 101 toward the light receiving elements 102 side facinglight emitting element 101. According to device 110 in this exemplaryembodiment, optical member 104 includes reflection mirror 141AB, andtherefore an area of the optical path of the infrared light indicated bytwo-dot chain lines in FIG. 23 decreases in correspondence with aportion of the optical path of the infrared light folded by reflectionmirror 141AB, in comparison with the foregoing device which includes theoptical member having the optical path for linear emission.

The structure of optical member 104 including first reflection mirror141AA, reflection mirror 141AB, third reflection mirrors 141BA and141BB, and fourth reflection mirror 141C allows infrared light emittedfrom light emitting element 101 to be guided toward the light receivingelements 102 side. Optical member 104 is provided with air hole 142which penetrates optical member 104 in the direction of the thicknessthereof. Air hole 142 has a rectangular shape in the plan view. Opticalmember 104 is capable of introducing the detection target gas into space140A through air hole 142. Dust filter 111 is provided on accommodationrecess 142A of optical member 104 so as to cover air hole 142 of opticalmember 104. Dust filter 111 prevents dust or other foreign material fromentering into air hole 142. Dust filter 111 is fixed to accommodationrecess 142A via a not-shown adhesive. Optical member 104 has rectangularparallelepiped projections 143 (see FIG. 20) projecting toward the board106 side on surface 144 of optical member 104 at four corners of thetrapezoidal shape of optical member 104, respectively. Support body 103has engaging projections 135 (see FIG. 21) projecting toward the opticalmember 104 side on one surface 130A thereof. Each of engagingprojections 135 may include a semispherical tip, and have a cylindricalshape on the whole, for example. Support body 103 has a pair of engagingprojections 135 projecting toward the optical member 104 side at the oneend of support body 103 on one surface 130A. Support body 103 has oneengaging projection 135 projecting toward the optical member 104 side ata center of the other end of support body 103 on one surface 130A.Optical member 104 is provided with engaging holes 145 (see FIG. 20) forengaging with engaging projections 135 of support body 103.

According to device 110, support body 103 can be positioned with respectto optical member 104 by engagement between engaging projections 135 andengaging holes 145. According to device 110, alignment between lightemitting element 101 and first reflection mirror 141AA is facilitated byuse of engaging projections 135 and engaging holes 145. According todevice 110, alignment between first light receiving element 121 andthird reflection mirror 141BA is facilitated by use of engagingprojections 135 and engaging holes 145. According to device 110,alignment between second light receiving element 122 and thirdreflection mirror 141BB is facilitated by use of engaging projections135 and engaging holes 145. Device 110 is allowed to position lightemitting element 101 at a focus of the parabolic reflection surface offirst reflection mirror 141AA by engagement between support body 103 andoptical member 104. Device 110 according to this exemplary embodiment isallowed to position first light receiving element 121 at a focus of theparabolic reflection surface of third reflection mirror 141BA byengagement between support body 103 and optical member 104. Device 110according to this exemplary embodiment is allowed to position secondlight receiving element 122 at a focus of the parabolic reflectionsurface of third reflection mirror 141BB by engagement between supportbody 103 and optical member 104.

In device 110, optical member 104 is overlaid on board 106 with supportbody 103 interposed therebetween by insertion of projections 143 ofoptical member 104 into insertion holes 162A of board 106. According todevice 110, optical member 104 is fixed to board 106 via support body103 in a state of insertion of projections 143 of optical member 104into insertion holes 162A of board 106. Device 110 is allowed toposition support body 103 and reflection body 108 by insertion ofengaging projections 135 of support body 103 into through holes 185A ofreflection body 108. According to device 110, alignment between lightemitting element 101 and first opening 181A is facilitated by use ofengaging projections 135 and through holes 185A. According to device110, alignment between light receiving elements 102 and second openings182A is facilitated by use of engaging projections 135 and through holes185A. Device 110 allows transmission of infrared light emitted fromlight emitting element 101 via first opening 181A by mounting reflectionbody 108 on support body 103. According to device 110 in this exemplaryembodiment allows light receiving elements 102 to receive infrared lightpassing through second opening 182A by mounting reflection body 108 onsupport body 103.

Device 110 is capable of introducing the outside air into space 140Asurrounded by optical member 104 and reflection body 108 via air hole142. According to device 110, an amount of infrared light transmittedthrough first optical filter 151 and received by first light receivingelement 121 decreases with respect to that of infrared light emittedfrom light emitting element 101 in accordance with a concentration ofthe detection target gas. When the concentration of the detection targetgas is low, an amount of infrared light received by first lightreceiving element 121 becomes close to the amount of infrared lightemitted from light emitting element 101 according to device 110. Whenthe concentration of the detection target gas is high, the amount ofinfrared light received by first light receiving element 121 decreases.According to device 110, an amount of infrared light transmitted throughsecond optical filter 152 and received by second light receiving element122 does not vary in accordance with the concentration of the detectiontarget gas.

In device 110, signal processing circuit unit 107 processes signalsindicating an amount of received infrared light and output from lightreceiving elements 102. Device 110 is capable of detecting aconcentration of the detection target gas contained in space 140Asurrounded by optical member 104 and reflection body 108.

According to device 110 in this exemplary embodiment, signal processingcircuit unit 107 calculates the concentration of the detection targetgas based on a difference between output signal levels output from thepair of light receiving elements 102. Signal processing circuit unit 107obtains the difference between the output signal levels output fromfirst light receiving element 121 and second light receiving element122, and calculates the concentration of the detection target gas basedon this difference.

According to device 110, signal processing circuit unit 107 calculatesthe concentration of the detection target gas based on the differencebetween the signal levels output from first light receiving element 121and second light receiving element 122. According to device 110, it ispossible to cancel variations of respective signal levels output fromlight receiving elements 102 based on the difference between the outputsignal levels from first light receiving element 121 and second lightreceiving element 122 so as to prevent detection accuracy from loweringat the time of detection of a concentration of a gas.

When signal processing circuit unit 107 of device 110 calculates aconcentration of a gas based on only the signal level output from one oflight receiving elements 102, detection accuracy at the time ofdetection of the concentration of the gas may lower due to a variationof the output signal level from light receiving element 102 caused bysome disturbance factor. However, when signal processing circuit unit107 of device 110 according to this exemplary embodiment calculates aconcentration of the detection target gas based on a difference betweensignal levels output from the pair of light receiving elements 102,lowering of detection accuracy at the time of detection of theconcentration of the gas is suppressed by canceling variations of theoutput signal levels from respective light receiving elements 102.

In device 110 in this exemplary embodiment, wiring of board 106 iselectrically connected to conductor wiring 161 configured to outputtingsignals received from light receiving elements 102 to the outside.Conductor wiring 161 is electrically connected with the wiring formed onfront surface 160A of board 106. Board 106 is provided with throughholes 161A each formed at a center of conductor wiring 161 andpenetrating board 106 (see FIG. 24). Metal terminals 165 (see FIG. 25)for outputting signals received from light receiving elements 102 can beinserted into through holes 161A. On board 106, metal terminals 165inserted into through holes 161A are electrically connected withconductor wiring 161 via not-shown soldering, for example.

In device 110 in this exemplar embodiment, light emitting element 101,second light receiving element 122, and first light receiving element121 are disposed in this order on support body 103 in the plan view. Inother words, according to device 110, first light receiving element 121and second light receiving element 122 are disposed adjacent to eachother. Accordingly, device 110 in this exemplary embodiment reduces adetection time difference produced in detecting a gas by use of firstlight receiving element 121 and second light receiving element 122 inaccordance with an entrance speed of the detection target gas into space140A, and therefore device 110 is capable of detecting a gas moreaccurately than gas detector 1310 disclosed in the PTL.

A method for manufacturing device 110 according to this exemplaryembodiment is hereinafter described with reference to FIGS. 19A through28.

According to the method for manufacturing device 110, electronic part171 is mounted on board 106 at the beginning. According to the methodfor manufacturing device 110, electronic part 171 constituting signalprocessing circuit unit 107 is soldered to the wiring of board 106 byreflow soldering, for example. Frame-shaped support body 103 ispositioned on board 106 so as to surround an area where electronic part171 is mounted (see FIG. 21). Light emitting element 101 and lightreceiving elements 102 may be mounted on the one surface 130A side ofsupport body 103 in advance. According to the method for manufacturingdevice 110, support body 103 and board 106 are aligned by insertion ofprojections (not shown) projecting from support body 103 toward theboard 106 side into holes 163A (see FIG. 24) of board 106.

When an automatic assembling device (not shown) is used in the methodfor manufacturing device 110, mounting positions of light emissionelement 101 and light receiving elements 102 are determined byperforming an imaging process (such as edge detection) for an image ofsupport body 103 imaged by an imaging device of the automatic assemblingdevice. According to the method for manufacturing device 110, themounting position of light emitting element 101 may be determined withreference to an edge of a shape of first recess 133. The mountingpositions of light receiving elements 102 may be determined withreference to edges of shapes of second recesses 134. According to themethod for manufacturing device 110, light emitting element 101 ismounted on an inner bottom surface of first recess 133 of support body103 via a die bond material such as epoxy resin. Similarly, according tothe method for manufacturing device 110, light receiving elements 102are mounted on inner bottom surfaces of second recesses 134 of supportbody 103 via die bond materials such as epoxy resin. According to themethod for manufacturing device 110, the wiring side formed on frontsurface 160A of board 106 is electrically connected to light emittingelement 101 by wire bonding using metal wire. According to the methodfor manufacturing device 110, the wiring side formed on front surface160A of board 106 is electrically connected to light receiving elements102 by wire bonding using metal wire. According to the method formanufacturing device 110, optical filters 105 are disposed on the pairof second steps 132B formed in the inner walls of each of secondrecesses 134 of support body 103 in such a manner that optical filters105 cover corresponding light receiving elements 102. Similarly,according to the method for manufacturing device 110, cover member 109is disposed on the pair of first steps 132A formed in the inner walls offirst recess 133 of support body 103 in such a manner that cover member109 covers light emitting element 101.

Subsequently, according to the method for manufacturing device 110,reflection body 108 is positioned on support body 103 on which opticalfilters 105 and cover member 109 are disposed (see FIG. 22). Accordingto the method for manufacturing device 110, support body 103 andreflection body 108 are aligned by insertion of engagement projections135 projecting from support body 103 toward the optical member 104 sideinto through holes 185A of reflection body 108. According to the methodfor manufacturing device 110, first opening 181A and light emittingelement 101 are aligned by alignment between support body 103 andreflection body 108. In addition, according to the method formanufacturing device 110, second openings 182A and light receivingelements 102 are aligned by alignment between support body 103 andreflection body 108.

According to the method for manufacturing device 110, optical member 104is overlaid on board 106 with support body 103 interposed therebetweenby insertion of projections 143 projecting from optical member 104toward the board 106 side into insertion holes 162A of board 106 afterpositioning of reflection body 108 on support body 103 (see FIGS. 20 and21). According to the method for manufacturing device 110, projections143 of optical member 104 are joined to lands 162 formed aroundinsertion holes 162A by soldering. In device 110, projections 143 ofoptical member 104 are joined to lands 162 around insertion holes 162Aby soldering (not shown).

In device 110, optical member 104 formed as a resin molded componentwhose outside surface 140B is coated with metal material is electricallyconnected to lands 162 around insertion holes 162A of board 106. Ondevice 110, lands 162 around insertion holes 162A of board 106 aregrounded. Accordingly, optical member 104 is a resin molded componentwhose outside surface 140B is coated with the metal portion made ofmetal material, and the metal material is electrically connected to theground of board 106.

According to device 110, a potential of optical member 104 coated withthe metal portion of metal material may be set to a reference potential.In device 110, noise is prevented from occurring in electronic part 171or the like provided on board 106 covered by optical member 104. Thenoise may occur resulting from entrance of electromagnetic waves fromthe outside of device 110. Similarly, according to device 110, apotential of reflection body 108 contacting optical member 104 isallowed to be set to the reference potential in accordance with settingof the potential of optical member 104 coated with the metal portion ofmetal material to the reference potential. By setting the potential ofreflection body 108 to the reference potential, noise is furtherprevented from occurring in electronic part 171 or the like provided onboard 106 covered by reflection body 108. The noise may occur resultingfrom entrance of electromagnetic waves from the outside of device 110.

According to device 110 in this exemplary embodiment, metal terminals165 are inserted into through holes 161A of board 106. According todevice 110, conductor wiring 161 formed around through holes 161A ofboard 106 is electrically connectable with metal terminals 165 viasoldering (not shown), for example. Device 110 is electricallyconnectable with an external apparatus via metal terminals 165.According to device 110, patterns of conductor wiring 161 formed onboard 106 can be changed relatively easily in comparison with a devicein which terminals for outputting signals received from light receivingelements 102 to the outside are formed in a resin component by insertmolding.

In device 110 according to this exemplary embodiment, optical member 104is optically coupled with support body 103 on which light emittingelement 101 and light receiving elements 102 are mounted as elementsrequiring relatively high alignment accuracy. In addition, in device110, optical member 104 is fixed to board 106 which does not requirerelatively high alignment accuracy with support body 103 and opticalmember 104 in comparison with the optical coupling. According to device110, conductor wiring 161 for outputting signals from the lightreceiving elements 102 side to the outside is provided on board 106which does not require relatively high alignment accuracy, and thereforea degree of freedom for electric connection to the outside furtherincreases. In other words, in device 110 according to this exemplaryembodiment, support body 103 which holds light emitting element 101 andlight receiving elements 102 with a predetermined distance therebetweenis functionally separated from board 106 which includes conductor wiring161 for outputting signals to the outside.

Accordingly, device 110 of different mount configuration can bemanufactured only by replacing board 106 containing conductor wiring 161with board 106 having a different configuration. This structurestandardizes components constituting device 110, and can increase adegree of freedom for electric connection between device 110 and anexternal apparatus provided outside device 110 for each type ofapparatus on which device 110 of this exemplary embodiment is mounted.

According to device 110 in this exemplary embodiment, reflection body108 includes first opening 181A through which infrared light emittedfrom light emitting element 101 passes. Reflection body 108 includessecond openings 182A through which infrared light to be received bylight receiving elements 102 passes. In device 110, translucent covermember 109 closes first opening 181A. In device 110, optical filters 105close second openings 182A. Translucent cover member 109 and opticalfilters 105 prevent a gas from flowing toward the light receivingelements 102 side from space 140A surrounded by reflection body 108,cover member 109, optical filters 105, and optical member 104. Opticalfilters 105 are considered to have translucency. Accordingly, covermember 109 is considered as a first translucent cover member, whileoptical filters 105 are considered as second translucent cover members.

While a configuration of each of light receiving elements 102 of device110 according to this exemplary embodiment is not shown in the figure,each of light receiving elements 102 may have a configuration of apyroelectric infrared sensor which includes a membrane disposed on acavity portion and formed of an insulation film, and contains apyroelectric element which includes a pyroelectric material disposed onthe insulation film and sandwiched between electrodes. This infraredsensor may be formed in an appropriate manner by using MEMS (MicroElectro Mechanical Systems) technology, for example.

According to an example of a device which does not include cover member109 presented in comparison with device 110 according to this exemplaryembodiment, a detection target gas may flow from the space 140A sidetoward the light receiving elements 102 side via first opening 181A.When the detection target gas flows from the space 140A side toward thelight receiving elements 102 side in the device of the comparisonexample, the membrane of the infrared sensor may be deformed by pressureof the gas. When the membrane of the infrared sensor is deformed in thedevice of the comparison example, detection errors of the infraredsensor or damage to the infrared sensor may be caused.

According to device 110 in this exemplary embodiment, however, detectionerrors of the infrared sensor and damage to the infrared sensor causedby pressure of the detection target gas are suppressed even when each oflight receiving elements 102 includes the infrared sensor containing amembrane.

Device 110 according to this exemplary embodiment is applicable to a gassensor equipped on an air conditioner, a gas detection alarm, a vehicleexhaust gas measuring device, and alcohol detector, for example.

The respective components included in device 110 according to thisexemplary embodiment are hereinafter described in more detail.

Light emitting element 101 is capable of emitting infrared light. Lightemitting element 101 may be constituted by a semiconductor bare chip.Light emitting element 101 is not limited to a semiconductor bare chip,but may be constituted by a chip size package. Light emitting element101 may be constituted by a light emitting diode chip, or a resistanceelement or a laser diode provided on a semiconductor substrate, forexample. Light emitting element 101 is capable of emitting infraredlight having a wavelength easily absorbable by a detection target gas.Light emitting element 101 can be electrically connected with wiring onboard 106 by an appropriate method such as wire bonding. The entire sizeof device 110 can be smaller when light emitting element 101 isconstituted by a semiconductor bare chip, in comparison with a devicewhich uses a package type light emitting diode.

Light receiving elements 102 are capable of receiving infrared light andconverting the infrared light into electric signals. Light receivingelements 102 may be constituted by semiconductor bare chips. Lightreceiving elements 102 are not limited to semiconductor bare chips, butmay be constituted by chip size packages. Light receiving elements 102may be constituted by pyroelectric elements or photodiode chips, forexample. Light receiving elements 102 can be electrically connected withwiring provided on board 106 by an appropriate method such as wirebonding. The entire size of device 110 can be smaller when lightreceiving elements 102 are constituted by semiconductor bare chips, incomparison with a device which uses package type photodiodes.

Support body 103 is capable of supporting light emitting element 101 andlight receiving elements 102 at one end side on the one surface 130Aside of support body 103. Support body 103 may have a frame-shapedexternal appearance. Frame-shaped support body 103 is capable ofreceiving electronic part 171 mounted on board 106 and accommodatingelectronic part 171 within opening 131A thereof. Support body 103 may beconstituted by a resin molded component formed of a synthetic resinmolded body. Support body 103 may be made of polyphthalamide resin, forexample. On support body 103, cover member 109 may be disposed on firststeps 132A so as to cover light emitting element 101. On support body103, optical filters 105 may be positioned on second steps 132B so as tocover light receiving elements 102. Reflection body 108 may bepositioned so as to cover opening 131A of frame-shaped support body 103.In reflection body 108, a fifth optical path changing portion can beprovided so as to reflect and guide infrared light from the firstreflection mirror 141AA side to the third reflection mirrors 141BA and141BB side via reflection mirror 141AB. Reflection body 108 may close apart of opening 131A of frame-shaped support body 103. Supportingreflection body 108 covering opening 131A of frame-shaped support body103 and reflecting infrared light toward space 140A by support body 103can increase light utilization efficiency.

Optical member 104 is so configured that infrared light from lightemitting element 101 can be guided toward the light receiving elements102 side. Optical member 104 is capable of covering the one surface 130Aside of support body 103 via space 140A into which the detection targetgas is introducible. Optical member 104 may be constituted by a resinmolded component formed of a synthetic resin molded body. Optical member104 may be made of polyphthalamide resin, for example. Optical member104 is not limited to a resin molded component, but may be made of metalmaterial. Optical member 104 constituted by a resin molded component hasa more accurate external appearance than a component made of metalmaterial. It is preferable that outside surface 140B of optical member104 is coated with metal material when optical member 104 is formed as aresin molded component. Optical member 104 may have a parallelepipedshape having an external size equivalent to that of support body 103 inthe plan view. Optical member 104 is allowed to be fixed to board 106 ina manner that a recess of optical member 104 faces board 106 via supportbody 103. Optical member 104 may be provided with air hole 142penetrating optical member 104 in the direction of the thickness ofoptical member 104. According to optical member 104, the detectiontarget gas can be introduced into space 140A through air hole 142.According to optical member 104, the detection target gas can bedischarged out of space 140A through air hole 142. It is preferable thatair hole 142 of optical member 104 is covered by dust filter 111 toprevent foreign material other than the outside air, such as dust, fromentering into air hole 142. Air hole 142 may have a rectangular shape inthe plan view, for example. The shape of air hole 142 is not limited toa rectangular shape, but may have other shapes such as a circular shapein the plan view. The number of air hole 42 is not limited to one, butmay be two or more.

Optical member 104 may include first reflection mirror 141AA, reflectionmirror 141AB constituting the second reflection mirror, third reflectionmirrors 141BA and 141BB, and fourth reflection mirror 141C, for example.Optical member 104 may include metal material such as gold and aluminumformed on the inner surface of the recess of optical member 104 bydeposition or plating.

The reflection surface of first reflection mirror 141AA is not limitedto a parabolic surface. First reflection mirror 141AA may have areflection surface having a flat shape, a spherical shape, or apolygonal shape. The reflection surface of reflection mirror 141AB isnot limited to a smooth flat surface. Reflection mirror 141AB may have areflection surface having a parabolic shape, a spherical shape, or apolygonal shape. Each of the reflection surfaces of third reflectionmirrors 141BA and 141BB is not limited to a parabolic surface. Each ofthird reflection mirrors 141BA and 141BB may have a reflection surfacehaving a flat shape, a spherical shape, or a polygonal shape. When thereflection surface of each of third reflection mirrors 141BA and 141BBof device 110 is made to be a concave surface, light reflected on thereflection surfaces of third reflection mirrors 141BA and 141BB isallowed to converge. Accordingly, infrared light can be efficientlyreceived by light receiving elements 102.

Each of optical filters 105 is capable of transmitting infrared lighthaving a predetermined wavelength band. Each of optical filters 105constitutes a band pass filter which has a transmission band containinga wavelength band of a wavelength of infrared light emitted from lightemitting element 101. Each of optical filters 105 may be formed of aninterference filter having a multilayered structure of dielectric films,for example. Examples of a base material of each of optical filters 105include Ge, Si and other semiconductor materials, and methacrylic resin.Optical filters 105 may be disposed on second steps 132B of support body103. Optical filters 105 may be fixed to second steps 132B of supportbody 103 via bonding material (not shown). Optical filters 105 may befixed to reflection body 108 via bonding material. Optical filters 105may be fixed to light receiving elements 102 via bonding material. Thebonding material employed herein may be made of glass having a lowmelting point, alloy having a low melting point, or resin material, forexample.

Board 106 can be attached to optical member 104 via support body 103.Board 106 may have a rectangular flat-plate external shape, for example.Board 106 is not limited to have a rectangular flat-plate shape, but mayhave various shapes such as a circular flat-plate shape and a polygonalflat-plate shape. Board 106 may be constituted by a glass epoxy resinsubstrate, or a ceramic multi-layered substrate, for example. Electronicpart 171 constituting signal processing circuit unit 107 may be mountedon board 106, for example. Board 106 includes wiring. Board 106 includesconductor wiring 161 capable of electrically connecting with the wiring.Conductor wiring 161 is capable of electrically connecting lightreceiving elements 102 and electronic part 171 constituting signalprocessing circuit unit 107 together via wiring so that signals fromlight receiving elements 102 can be output.

Board 106 is provided with through holes 161A penetrating board 106.According to board 106, conductor wiring 161 around through holes 161Aand can be electrically connected to terminals 165 inserted into throughholes 161A via soldering (not shown) or the like. Device 110 is allowedto be mounted on a wiring board (not shown) of an external apparatus byuse of metal terminals 165. Similarly, device 110 is allowed to includereceptacle 166 which contains contact pins 168 within connector body 167formed by insulation material (see FIG. 26), instead of use of metalterminals 165. Device 110 electrically connects contact pins 168 ofreceptacle 166 to conductor wiring 161. According to Device 110,conductor wiring 161 can be electrically connected, via receptacle 166,to a plug electrically connected with a wiring board on the apparatusside. Alternatively, according to device 110, surface mounting typereceptacle 169 may be surface-mounted on conductor wiring 161 of board106 illustrated in FIG. 27 via soldering or the like (see FIG. 28),instead of use of metal terminals 165. Device 110 can be electricallyconnected with the wiring board on the apparatus side by using metalterminals 165, receptacle 166, or receptacle 169. Device 110 ispreferably provided with screw holes 160C for receiving screws or thelike and fixing device 110 to the wiring board (not shown) of theexternal apparatus.

Signal processing circuit unit 107 is configured to control lightemitting element 101 to allow emission of infrared light from lightemitting element 101. Signal processing circuit unit 107 is configuredto process signals output from light receiving elements 102 uponreceiving infrared light. Signal processing circuit unit 107 may performsignal processing such as amplification, waveform shaping, signalsampling, and signal analog/digital conversion of the signals outputfrom light receiving elements 102. Signal processing circuit unit 107may further perform signal processing such as signal calculation, signalcorrection, and determination that the detection target gas has anabnormal concentration, for example. Signal processing circuit unit 107may be formed of electronic part 171 such as an integrated circuit.

Reflection body 108 is capable of reflecting infrared light toward space140A. Reflection body 108 may be a flat-shaped component formed of metalplate material. Examples of material of reflection body 108 includemetal material such as aluminum. Reflection body 108 is made of metal,and electrically connectable with the metal portion made of metalmaterial of optical member 104. Reflection body 108 may include thefifth optical path changing portion capable of reflecting infraredlight, and having a smooth surface on the side facing optical member104. Reflection body 108 is not required to be made of metal material,but may be a resin molded component. Reflection body 108 may be aflat-plate-shaped member formed as a resin molded component on whichgold, aluminum or other metal material is formed by deposition orplating.

Fifth Exemplary Embodiment

Device 110 according to this exemplary embodiment is different fromdevice 110 in the fourth exemplary embodiment illustrated in FIGS. 19Aand 19B chiefly in that the shape of optical member 104 and thepositions of optical filters 105 are different. Constituent elementssimilar to corresponding constituent elements in the fourth exemplaryembodiment are given similar reference numbers, and the same explanationis not repeated when omission of the explanation is appropriate.

In device 110 in this exemplary embodiment, first optical filter 151 isdisposed on optical member 104 between reflection mirror 141AB and thirdreflection mirror 141BA as illustrated in FIG. 29, for example.Similarly, in device 110 in this exemplary embodiment, second opticalfilter 152 is disposed on optical member 104 between reflection mirror141AB and third reflection mirror 141BB. In other words, optical filters105 are only required to be positioned on optical paths (see arrows inFIGS. 30A and 30B) for guiding infrared light from light emittingelement 101 toward light receiving elements 102 as illustrated in FIGS.30A and 30B. FIG. 30A is a cross-sectional view illustrating a crosssection of device 110 taken along a line 30A-30A in FIG. 29. On theother hand, FIG. 30B is a cross-sectional view illustrating a crosssection of device 110 taken along a line 30B-30B in FIG. 29.

Device 110 according to this exemplary embodiment includes separationwall 146 which separates optical paths of infrared lights to be receivedby first light receiving element 121 and second light receiving element122 on optical member 104. Separation wall 146 reduces mutual effect oninfrared lights received by first light receiving element 121 and secondlight receiving element 122 in optical member 104 as a result ofscattering of the infrared lights or others. According to device 110 inthis exemplary embodiment, separation wall 146 of optical member 104holds first optical filter 151 and second optical filter 152.

Sixth Exemplary Embodiment

Device 110 according to this exemplary embodiment is different fromdevice 110 in the fourth exemplary embodiment in that three or more setsof optical filter 105 and light receiving element 102 are provided forone light emitting element 101 instead of two sets of optical filter 105and light receiving element 102 for one light emitting element 101 as inthe fourth exemplary embodiment illustrated in FIGS. 19A and 19B.Constituent elements similar to corresponding constituent elements inthe fourth exemplary embodiment have been given similar referencenumbers, and the same explanation is not repeated when omission of theexplanation is appropriate.

According to device 110 in this exemplary embodiment, as in the fourthexemplary embodiment, optical filters 105 include first optical filter151 which has a transmission band containing infrared light in awavelength band absorbable by a detection target gas, and second opticalfilter 152 which has a transmission band different from that of firstoptical filter 151. Light receiving elements 102 include first lightreceiving element 121 which photoelectrically converts infrared lighttransmitted through first optical filter 151, and second light receivingelement 122 which photoelectrically converts infrared light transmittedthrough second optical filter 152. According to device 110 in thisexemplary embodiment, optical filters 105 further include third opticalfilter 153 which has a transmission band different from those of firstoptical filter 151 and second optical filter 152 as illustrated in FIGS.31 and 32. Light receiving elements 102 include third light receivingelement 123 which photoelectrically converts infrared light transmittedthrough third optical filter 153. Optical member 104 includes thirdreflection mirrors 141BA and 141BB. According to the device in thisexemplary embodiment, optical member 104 further includes thirdreflection mirror 141BC as illustrated in FIG. 31.

This structure allows device 110 according to this exemplary embodimentto detect various types of gases. While device 110 according to thefourth exemplary embodiment is an example of a gas sensor for detectinga concentration of one type of gas contained in the outside air, device110 including a plurality of sets of light receiving element 102 andoptical filter 105 becomes a gas sensor capable of detectingconcentrations of gases of different types for each set of lightreceiving element 102 and optical filter 105. Device 110 according tothis exemplary embodiment includes three or more sets of light receivingelement 102 and optical filter 105, and is thus capable of detectingconcentrations of gases of different types based on outputs fromrespective light receiving elements 102.

Device 110 according to this exemplary embodiment includes first lightreceiving element 121 as one of light receiving elements 102 for gasdetection. Device 110 further includes second light receiving element122 as the other one of light receiving elements 102 for gas detection.According to device 110 in this exemplary embodiment, each of opticalfilters 105 constitutes a band pass filter which has a transmission bandcontaining a predetermined wavelength. Device 110 in this exemplaryembodiment which includes a plurality of sets of receiving element 102for gas detection and optical filter 105 is capable of detecting aplurality of gases. Device 110 according to this exemplary embodiment iscapable of independently detecting concentrations of two different typesof gases among a plurality of types of gases contained in the outsideair. Device 110 according to this exemplary embodiment is capable ofsimultaneously detecting both of a first gas (such as carbon monoxide)and a second gas (such as nitrogen oxide) of two types of gases.Moreover, device 110 according to this exemplary embodiment includesthird optical filter 153 which transmits a band not absorbed by eitherthe first gas or the second gas. Third light receiving element 123receives infrared light transmitted through third optical filter 153,photoelectrically converts the infrared light into a signal, and outputsthe signal to signal processing circuit unit 107. Signal processingcircuit unit 107 measures a change ratio from initial output from lightemitting element 101 based on the signal output from third lightreceiving element 123. According to device 110, signal processingcircuit unit 107 corrects output from first light receiving element 121and output from second light receiving element 122 after measuring thechange ratio from the initial output from light emitting element 101.Device 110 is capable of eliminating deterioration of light emittingelement 101 with time or other effects, and improving measurementaccuracy by correcting outputs from first light emitting element 121 andsecond light emitting element 122.

Seventh Exemplary Embodiment

Device 210 according to this exemplary embodiment is hereinafterdescribed with reference to FIGS. 33 through 35.

FIGS. 33 and 34 are a cross-sectional explanatory view illustratingdevice 210 according to a seventh exemplary embodiment, and a plan viewillustrating an essential part of device 210, respectively. Device 210according to this exemplary embodiment is a gas detecting device. Device210 includes light emitting element 201, light receiving element 202,signal processing circuit unit 207, optical member 204, and board 206.Signal processing circuit unit 207 processes a signal output from lightreceiving element 202. Optical member 204 covers light emitting element201 and light receiving element 202. Light emitting element 201, lightreceiving element 202, signal processing circuit unit 207, and opticalmember 204 are mounted on board 206. Board 206 includes conductor wiring261 electrically connected with light receiving element 2.

This structure increases a degree of freedom for electric connectionbetween device 210 according to this exemplary embodiment and theoutside.

Device 210 according to this exemplary embodiment includes lightemitting element 201 capable of emitting infrared light, and lightreceiving element 202 capable of photoelectrically converting infraredlight. Device 210 includes optical member 204 capable of guiding theinfrared light emitted from light emitting element 201 toward lightreceiving element 202. Device 210 includes optical filter 205 disposedon an optical path (see chain line arrows in FIG. 33) for guiding theinfrared light emitted from light emitting element 201 toward the lightreceiving element 202 side.

Light emitting element 201 and light receiving element 202 are disposedon one surface 260A side of board 206. Board 206 includes conductorwiring 261 for outputting a signal from light receiving element 202 tothe outside. Optical member 204 is provided on the one surface 260A sideof board 206 via space 240A into which a detection target gas isintroducible. Optical member 204 includes first reflection mirror 241Bdisposed on the side opposed to one surface 260A of board 206 andcapable of reflecting the infrared light emitted from light emittingelement 201 and guiding the infrared light in a direction perpendicularto one surface 260A toward light receiving element 202 disposed on theone surface 260A side of board 206. Board 206 has reflection body 208capable of reflecting infrared light on the one surface 260A side.Reflection body 208 includes first opening 281A through which theinfrared light emitted from light emitting element 201 passes.Reflection body 208 includes second reflection mirror 280AA on acircumference of first opening 281A. Second reflection mirror 280AAconverges infrared light in a direction perpendicular to one surface260A. Reflection body 208 includes second opening 282A through which theinfrared light reflected on the opposed surface passes. Reflection body208 includes third reflection mirror 280AC on a circumference of secondopening 282A. Third reflection mirror 280AC converges infrared light onlight receiving element 202. This structure increases gas detectionaccuracy of device 210 according to this exemplary embodiment.

According to device 210, an infrared light wavelength absorbable by agas varies for each detection target gas. In addition, according todevice 210, an infrared light absorptivity by a gas may vary for eachdetection target gas. Furthermore, according to device 210, desireddetection accuracy may vary for each detection target gas in accordancewith use purposes. According to device 210 in this exemplary embodiment,optical member 204 appropriate for each detection target gas isselectable. According to device 210 in this exemplary embodiment, anoptical path length for guiding infrared light is allowed to change onlyby replacing optical member 204. Accordingly, in case of device 210 inthis exemplary embodiment, an optical path length corresponding toabsorbability of infrared light by a detection target gas, for example,is selectable only by replacement of optical member 204. According todevice 210 in this exemplary embodiment, detection accuracy fordetecting different detection target gases increases only by replacementof optical member 204 or optical filter 205. According to device 210 inthis exemplary embodiment, components constituting device 210 areallowed to be standardized regardless of types of detection targetgases. Device 210 which includes a plurality of standardized componentsconstituting device 210 achieves reduction of manufacturing cost ofdevice 210, regardless of types of detection target gases.

A more specific configuration of device 210 according to this exemplaryembodiment is hereinafter described.

In device 210 in this exemplary embodiment, light emitting element 201emitting infrared light and light receiving element 202 forphotoelectrically converting infrared light are mounted on board 206.Board 206 has a rectangular flat plate shape (see FIG. 34). Board 206 isformed of a glass epoxy resin substrate. Board 206 includes wiring 263which is conductor pattern on one surface 260A thereof. In device 210,electronic part 271 is mounted on other surface 260B of board 206 on theside opposite to one surface 260A. Electronic part 271 is electricallyconnected with wiring (not shown) on the other surface 260B side ofboard 206 via soldering (not shown). The wiring on the other surface260B side of board 206 is electrically connected with wiring 263 on theone surface 260A side of board 206 by through hole wiring (not shown) orthe like. While only one electronic part 271 is shown in the figureaccording to device 210 in this exemplary embodiment, a plurality ofelectronic parts 271 may be mounted on board 206. A plurality ofelectronic parts 271 may be electrically connected with each other viawiring provided on board 206. Electronic part 271 constitutes signalprocessing circuit unit 207. According to device 210, signal processingcircuit unit 207 may be constituted by a plurality of electronic parts271. Signal processing circuit unit 207 is configured to allow emissionof infrared light from light emitting element 201 by controlling lightemitting element 201. Signal processing circuit unit 207 is configuredto process a signal output from light receiving element 202 uponreceiving infrared light. Signal processing circuit unit 207 performssignal processing such as amplification, waveform shaping, signalsampling, and signal analog/digital conversion of the signal output fromlight receiving element 202. Signal processing circuit unit 207 furtherperforms signal processing such as signal calculation, signalcorrection, and determination that the detection target gas has anabnormal concentration, for example. Accordingly, electronic part 271for processing a signal output from light receiving element 202 ismounted on board 206. According to device 210 in this exemplaryembodiment, electronic part 271 constituting signal processing circuitunit 207 is covered with protection cover 214. Protection cover 214covering electronic part 271 constituting signal processing circuit unit207 is fixed to the other surface 260B side of board 206.

In device 210, light emitting element 201 is mounted on one surface 260Aof board 206 via a die bond material (not shown). According to device210, wiring 263 formed on one surface 260A of board 206 and lightemitting element 201 are electrically connected by wire bonding usingmetal wire 212 (see FIG. 34), for example. Light emitting element 201 isconstituted by a light emitting diode capable of emitting infraredlight. This light emitting diode is constituted by a semiconductor barechip. Light emitting element 201 emits infrared light having awavelength easily absorbed by the detection target gas. Examples of thedetection target gas include carbon monoxide, carbon dioxide, methane,and nitrogen oxide. The structure of light emitting element 201 mountedon one surface 260A of board 206 is capable of reducing mutual thermaleffect between light emitting element 201 and the signal processingcircuit unit 207 side provided on other surface 260B of board 206.

In device 210, light receiving element 202 is mounted on one surface260A of board 206 via a die bond material (not shown). According todevice 210, wiring 263 and light receiving element 202 both formed onone surface 260A of board 206 are electrically connected to each othervia wire bonding using metal wire 212. Light receiving element 202includes an infrared sensor capable of receiving infrared light. Theinfrared sensor is constituted by a pyroelectric element. The infraredsensor is provided as a semiconductor bare chip. Light emitting element201 and light receiving element 202 are disposed on the one surface 260Aside of board 206 with a predetermined distance therebetween.

On the one surface 260A side of board 206, reflection body 208 isprovided so as to cover light emitting element 201 and light receivingelement 202. According to device 210 in this exemplary embodiment,reflection body 208 has a bottomed and square cylindrical shape.Reflection body 208 includes first opening 281A formed in an innerbottom surface of the bottomed and square cylindrical shape. Infraredlight emitted from light emitting element 201 passes through firstopening 281A. First opening 281A has a paraboloidal shape which flareswith farness from one surface 260A in a direction perpendicular to onesurface 260A of board 206. Reflection body 208 includes secondreflection mirror 280AA on a circumference of first opening 281A. Afocus of second reflection mirror 280AA is positioned on light emittingelement 201. Second reflection mirror 280AA converges infrared light ina direction perpendicular to one surface 260A. Reflection body 208further includes second opening 282A formed in the inner bottom surfaceof the bottomed and square cylindrical shape. Infrared light passesthrough second opening 282A. Second opening 282A has a paraboloidalshape which flares with farness from one surface 260A in a directionperpendicular to one surface 260A of board 206. Infrared light emittedfrom light emitting element 201 and reflected on the opposed surfaces ofoptical member 204 is allowed to pass along reflection body 208.Reflection body 208 includes third reflection mirror 280AC on acircumference of second opening 282A. A focus of third reflection mirror280AC is positioned on light receiving element 202. Third reflectionmirror 280AC converges infrared light on light receiving element 202. Inreflection body 208, first opening 281A is closed by translucent covermember 209. Reflection body 208 includes accommodation recess 280Dformed in an outer bottom surface of bottomed and square cylindricalreflection body 208. In reflection body 208, cover member 209 isaccommodated within accommodation recess 280D so as to cover lightemitting element 201.

In reflection body 208, second opening 282A is closed by optical filter205. Optical filter 205 is capable of constituting a band pass filterwhich has a transmission band containing a predetermined wavelength bandin infrared wavelengths emitted from light emitting element 201. Inreflection body 208, optical filter 205 is accommodated in accommodationrecess 280D of reflection body 208 so as to cover light receivingelement 202. Reflection body 208 may be formed as a resin moldedcomponent.

Device 210 according to this exemplary embodiment includes opticalmember 204 which covers one surface 260A of board 206 on whichreflection body 208 is disposed. Optical member 204 has a bottomed andsquare cylindrical external shape. Optical member 204 is made of metalmaterial. Examples of metal material constituting optical member 204include aluminum, stainless steel, and copper. Optical member 204 may beformed by pressing of a metal plate. Optical member 204 constitutes acover for covering the one surface 260A side of board 206 on which lightemitting element 201 and light receiving element 202 are mounted.Optical member 204 has a bottomed and square cylindrical shape whoseinternal size is slightly larger than an external size of reflectionbody 208 in a plan view. Optical member 204 is provided with a recessopened to the board 206 side. According to device 210, the recess ofoptical member 204 forms space 240A into which the detection target gasis introducible.

As illustrated in FIG. 33, optical member 204 is provided on board 206such that an inner bottom surface of the bottomed and square cylindricalshape of optical member 204 faces one surface 260A of board 206. Opticalmember 204 includes first reflection mirror 241B disposed on the innerbottom surface side of the bottomed square cylindrical shape so as toreflect infrared light in a predetermined direction. First reflectionmirror 241 Breflects infrared light emitted from light emitting element201 in a direction perpendicular to one surface 260A of board 206 andguides the infrared light toward light receiving element 202 on the onesurface 260A side of board 206. Optical member 204 includes metalmaterial constituting optical member 204, and first reflection mirror241B as separate components. Optical member 204 may include metalmaterial constituting optical member, and first reflection mirror 241Bas components formed integrally with each other. According to device 210in this exemplary embodiment, first reflection mirror 241B is formed offirst reflection portion 241BA and second reflection portion 241BB.First reflection portion 241BA may be constituted by a triangular prismmade of metal material, for example. Similarly, second reflectionportion 241BB may be constituted by a triangular prism made of metalmaterial, for example. First reflection portion 241BA and secondreflection portion 241BB are so disposed as to face each other. Firstreflection portion 241BA is so disposed as to face light emittingelement 201. Second reflection portion 241BB is so disposed as to facelight receiving element 202. First reflection mirror 241B includes firstreflection portion 241BA and second reflection portion 241BB formedseparately from each other. First reflection mirror 241B may includefirst reflection portion 241BA and second reflection portion 241BBformed integrally with each other. Optical member 204 includes firstreflection mirror 241B as a reflection mirror disposed on the opposedsurface side facing one surface 260A of board 206 so as to reflectinfrared light emitted from light emitting element 201 and guide theinfrared light again toward one end side of board 206. First reflectionmirror 241B constitutes an optical path changing portion of opticalmember 204. Optical member 204 is capable of reflecting infrared lightto guide the light from the first reflection portion 241BA side towardthe second reflection portion 241BB side on the bottom of the recess ofoptical member 204.

First reflection portion 241BA may include a smooth flat reflectionsurface. First reflection portion 241BA changes an optical path of theinfrared light emitted from light emitting element 201 into apredetermined direction perpendicular to a direction of a thickness ofboard 206. Second reflection portion 241BB is so disposed as to facefirst reflection portion 241BA, and may include a smooth flat reflectionsurface. Second reflection portion 241BB changes the optical path of theinfrared light after a change of the optical path by first reflectionportion 241BA into a direction crossing a light receiving surface oflight receiving element 202. According to device 210, optical member 204changes the optical path of infrared light traveling from light emittingelement 201 toward light receiving element 202 (see chain lines in FIG.33) into a C shape as illustrated in FIG. 33.

According to device 210 in this exemplary embodiment, size reduction isachievable in comparison with a device in which optical member 204 doesnot include first reflection mirror 241B but includes an optical memberforming an optical path for linear emission of infrared light from lightemitting element 201 toward the light receiving element 202 side facinglight emitting element 201. According to device 210 in this exemplaryembodiment, optical member 204 includes first reflection mirror 241B,and therefore an area of the optical path of the infrared lightdecreases in correspondence with a portion of the optical path of theinfrared light folded by first reflection mirror 241B in comparison withthe foregoing device which includes the optical member having theoptical path for linear emission.

Optical member 204 including first reflection mirror 241B can guide theinfrared light emitted from light emitting element 201 toward the lightreceiving element 202 side. Optical member 204 is provided with airholes 242 which penetrate optical member 204 in the direction of thethickness of optical member 204. Air holes 242 may have a rectangularshape, for example. Optical member 204 is capable of introducing thedetection target gas into space 240A through air holes 242. According tooptical member 204, dust filters 211 are provided on accommodationrecesses 242A of optical member 204 so as to cover air holes 242 ofoptical member 204, respectively. Each of dust filter 211 prevents dustor other foreign material from entering into air hole 242. Dust filter211 is fixed to accommodation recess 242A via a not-shown adhesive.

In device 210 according to this exemplary embodiment, reflection body208 is positioned on board 206. Device 210 allows positioning reflectionbody 208 with respect to board 206 by engagement between engagingprojections (not shown) of reflection body 208 and holes 263A of board206. In Device 210, alignment between light emitting element 201 andfirst opening 281A is facilitated by engagement between the engagingprojections (not shown) of reflection body 208 and holes 263A of board206. In Device 210, alignment between light receiving element 202 andsecond opening 282A is facilitated by engagement between the engagingprojections (not shown) of reflection body 208 and holes 263A.

According to device 210, infrared light emitted from light emittingelement 201 is allowed to pass through first opening 281A in a statethat reflection body 208 is mounted on board 206. According to device210 in this exemplary embodiment, light receiving element 202 canreceive the infrared light after passing through second opening 282A inthe state that reflection body 208 is mounted on board 206.

According to device 210, reflection body 208 can be positioned withrespect to optical member 204 by engagement between optical member 204and reflection body 208 disposed on board 206. In device 210, alignmentbetween light emitting element 201 and first reflection mirror 241B isfacilitated by engagement between optical member 204 and reflection body208. In device 210, alignment between first reflection mirror 241B andlight receiving element 202 is facilitated by engagement between opticalmember 204 and reflection body 208.

Optical member 204 includes rectangular parallelepiped projections (notshown) projecting from optical member 204 toward the board 206 side.According to device 210, optical member 204 is positioned on board 206while covering reflection body 208 by insertion of the projections ofoptical member 204 into insertion holes 262A of board 206. According todevice 210, optical member 204 is fixed to board 206 in a state ofinsertion of the projections of optical member 204 into insertion holes262A of board 206.

According to device 210, the outside air is introducible through airholes 242 into space 240A surrounded by optical member 204, opticalfilter 205, reflection body 208, and cover member 209. According todevice 210, an amount of infrared light transmitted through opticalfilter 205 and received by light receiving element 202 decreases withrespect to that of infrared light emitted from light emitting element201 in accordance with a concentration of the detection target gas. Whenthe concentration of the detection target gas is low, an amount ofinfrared light received by light receiving element 202 becomes close tothat of infrared light emitted from light emitting element 201 accordingto device 210. When the concentration of the detection target gas ishigh, the amount of infrared light received by light receiving element202 decreases.

According to device 210, signal processing circuit unit 207 processes asignal corresponding to an amount of received infrared light and outputfrom light receiving element 202. Device 210 is capable of detecting aconcentration of the detection target gas contained in space 240A ofoptical member 204. According to device 210 in this exemplaryembodiment, signal processing circuit unit 207 calculates theconcentration of the detection target gas based on a signal level of asignal output from light receiving element 202.

According to device 210 in this exemplary embodiment, wiring 263, andconductor wiring 261 for outputting a signal received from lightreceiving element 202 to the outside are provided on the one surface260A side of board 206. Conductor wiring 261 is electrically connectedwith wiring 263. Surface mounting type receptacle 269 is surface-mountedon conductor wiring 261 of board 206 via soldering or the like. Device210 is capable of being electrically connected to a wiring board (notshown) on the external apparatus side via output lines 269B extendedfrom plug 269A connected with receptacle 269. Device 210 may be providedwith screw holes 260C in board 206 for receiving screws or the likefixing device 210 to the wiring board of the apparatus.

A method for manufacturing device 210 according to this exemplaryembodiment is now described.

According to the method for manufacturing device 210, at the beginning,electronic part 271 is mounted on other surface 260B of board 206.According to the method for manufacturing device 210, electronic part271 constituting signal processing circuit unit 207 is soldered towiring on the other surface 260B side of board 206 by reflow soldering,for example. Protection cover 214 covers an area of board 206 whereelectronic part 271 is mounted so as to surround this area.

According to the method for manufacturing device 210, light emittingelement 201 is mounted on one surface 260A of board 206 by a die bondmaterial such as epoxy resin. Similarly, according to the method formanufacturing device 210, light receiving element 202 is mounted on onesurface 260A of board 206 by a die bond material such as epoxy resin.According to the method for manufacturing device 210, wiring 263 formedon one surface 260A of board 206 is electrically connected to lightemitting element 201 by wire bonding using metal wire 212. According tothe method for manufacturing device 210, wiring 263 formed on onesurface 260A of board 206 is electrically connected to light receivingelement 202 by wire bonding using metal wire 212.

According to the method for manufacturing device 210, reflection body208 is aligned with respect to board 206 by insertion of engagingprojections (not shown) projecting from reflection body 208 toward theboard 206 side into holes 263A of board 206 (see FIG. 34). According tothe method for manufacturing device 210, alignment between first opening281A and light emitting element 201 is achievable by alignment betweenreflection body 208 and board 206. According to the method formanufacturing device 210, alignment between second opening 282A andlight receiving element 202 is achievable by alignment betweenreflection body 208 and board 206. According to the method formanufacturing device 210, cover member 209 is positioned inaccommodation recess 280D of reflection body 208 so as to cover lightemitting element 201. Similarly, according to the method formanufacturing device 210, optical filter 205 is positioned inaccommodation recess 280D of reflection body 208 so as to cover lightreceiving element 202.

Thereafter, according to the method for manufacturing device 210,optical member 204 is positioned so as to cover reflection body 208where optical filter 205 and cover member 209 are disposed. According tothe method for manufacturing device 210, optical member 204 is overlaidon board 206 by insertion of the projections projecting from opticalmember 204 toward the board 206 side into insertion holes 262A of board206 after positioning of reflection body 208 on board 206 (see FIGS. 34and 35). According to the method for manufacturing device 210, theprojections of optical member 204 are fixedly attached to portions ofboard 206 around insertion holes 262A by adhesives or the like.

According to device 210 in this exemplary embodiment, reflection body208 includes first opening 281A through which infrared light emittedfrom light emitting element 201 passes. Reflection body 208 includessecond opening 282A through which infrared light to be received by lightreceiving element 202 passes. In device 210, translucent cover member209 closes first opening 281A and optical filter 205 closes secondopening 282A. According to device 210, optical filter 205 prevents a gasfrom flowing from the space 240A side of optical member 204 toward thelight receiving element 202 side. Similarly, cover member 209 prevents agas from flowing from the space 240A side of optical member 204 towardthe light receiving element 202 side. Optical filter 205 is consideredto have translucency. Accordingly, cover member 209 is considered as afirst translucent cover member, while optical filter 205 is consideredas a second translucent cover member.

While a configuration of light receiving element 202 is not shownaccording to device 210 in this exemplary embodiment, light receivingelement 202 may have a configuration of a pyroelectric infrared sensorincluding a membrane formed of an insulation film on a cavity portion,and containing a pyroelectric element which includes a pyroelectricmaterial sandwiched between electrodes on the insulation film, forexample. This infrared sensor may be formed in an appropriate manner byusing MEMS (Micro Electro Mechanical Systems) technology, for example.

In case of a device which does not include cover member 209 presented incomparison with device 210 in this exemplary embodiment, the detectiontarget gas may flow from the space 240A side toward the light receivingelement 202 side via first opening 281A. Similarly, in case of a devicewhich does not include optical filter 205 on second opening 282Apresented in comparison with device 210 in this exemplary embodiment,the detection target gas may flow from the space 240A side toward thelight receiving element 202 side via second opening 282A. According tothe device presented as a comparison, a membrane of an infrared sensormay be deformed by pressure of the target detection gas when the gasflows from the space 240A side toward the light receiving element 202side. When the membrane of the infrared sensor is deformed in the deviceof the comparison example, detection errors of the infrared sensor ordamage to the infrared sensor may be caused.

According to device 210 in this exemplary embodiment, however, detectionerrors of the infrared sensor and damage to the infrared sensor causedby pressure of the detection target gas are suppressed even when lightreceiving element 202 includes an infrared sensor provided with amembrane.

Device 210 according to this exemplary embodiment is applicable to a gassensor equipped on an air conditioner, a gas detection alarm, a vehicleexhaust gas measuring device, and alcohol detector, for example.

The respective components included in device 210 according to thisexemplary embodiment are hereinafter described in more detail.

Light emitting element 201 is capable of emitting infrared light. Aslight emitting element 201, a semiconductor bare chip may be used. Lightemitting element 201 is not limited to a semiconductor bare chip, butmay be constituted by a chip size package. Light emitting element 201may be constituted by a light emitting diode chip, or a resistanceelement or a laser diode provided on a semiconductor substrate, forexample. Light emitting element 201 is capable of emitting infraredlight having a wavelength easily absorbable by a detection target gas.Light emitting element 201 is allowed to be electrically connected towiring 263 on board 206 by an appropriate method such as wire bonding.The entire size of device 210 can be reduced when light emitting element201 is constituted by a semiconductor bare chip, in comparison with adevice which uses a package type light emitting diode.

Light receiving element 202 is capable of receiving infrared light andconverting the infrared light into an electric signal. As lightreceiving element 202, a semiconductor bare chip may be used. Lightreceiving element 202 is not limited to a semiconductor bare chip, butmay be constituted by a chip size package. Light receiving element 202may be constituted by a pyroelectric element or a photodiode chip, forexample. Light receiving element 202 is allowed to be electricallyconnected to wiring 263 provided on board 206 by an appropriate methodsuch as wire bonding. The entire size of device 210 can be reduced whenlight receiving element 202 is constituted by a semiconductor bare chip,in comparison with a device which uses a package type photodiode.

Optical member 204 is capable of guiding the infrared light from lightemitting element 201 toward light receiving element 202. Optical member204 is capable of covering the one surface 260A side of board 206 viaspace 240A into which the detection target gas is introducible. Opticalmember 204 may be formed as a resin molded component formed of asynthetic resin molded body. Optical member 204 may be made ofpolyphthalamide resin, for example. Optical member 204 is not limited toa resin molded component, but may be made of metal material. Opticalmember 204 formed as a resin molded component has a more accurateexternal appearance than a component made of metal material. It ispreferable that outside surface 240B of optical member 204 is coatedwith metal material when optical member 204 is formed as a resin moldedcomponent. Optical member 204 may have a rectangular shape having anexternal size equivalent to an external size of reflection body 208 in aplan view. Optical member 204 is allowed to be fixed to board 206 insuch a condition that a recess of optical member 204 faces one surface260A of board 206 via reflection body 208. Optical member 204 may beprovided with air holes 242 penetrating optical member 204 in adirection of a thickness of optical member 204. The detection target gascan be introduced into space 240A through air holes 242 of opticalmember 204. The detection target gas can be discharged from space 240Athrough air holes 242 of optical member 204. It is preferable that airholes 242 of optical member 204 are covered with dust filters 211 toprevent entrance of foreign material other than the outside air, such asdust, into air holes 242. Each of air holes 242 may have a rectangularshape in a plan view, for example. Each shape of air holes 242 is notlimited to a rectangular shape, but may have other shapes such as acircular shape in a plan view. The number of air holes 242 is notlimited to two, but may be one. Alternatively, three or more air holes242 may be formed.

Optical member 204 includes first reflection mirror 241B which reflectsthe infrared light emitted from light emitting element 201 in adirection perpendicular to one surface 260A on the side opposed to onesurface 260A and guides the infrared light toward light receivingelement 202 disposed on the one surface 260A side of board 206. Inoptical member 204, first reflection mirror 241B is allowed to be formedin an appropriate shape of a recess of optical member 204. Opticalmember 204 may be formed as a resin molded component whose outsidesurface 240B is coated with metal material. First reflection mirror 241Bmay be formed integrally with optical member 204 by determining a shapeof the resin molded component in an appropriate manner. For formingfirst reflection mirror 241B, metal material such as gold and aluminummay be formed on an inner surface of the recess of optical member 204 bydeposition or plating. The reflection surface of first reflection mirror241B is not limited to a smooth and flat-shaped surface. For example,first reflection mirror 241B may have a reflection surface having aparabolic shape, a spherical shape, or a polygonal shape. Alternatively,first reflection mirror 241B may have a reflection surface in a shapeproduced by combining a flat shape, a parabolic shape, a sphericalshape, or a polygonal shape in an appropriate manner.

Optical filter 205 is capable of transmitting infrared light in apredetermined wavelength band. Optical filter 205 constitutes a bandpass filter which has a transmission band containing a wavelength bandof a wavelength of infrared light emitted from light emitting element201. As optical filter 205, an interference filter having a multilayeredstructure of dielectric films may be used, for example. Examples of abase material of optical filter 205 include Ge, Si and othersemiconductor materials, and methacrylic resin. Optical filter 205 isallowed to be accommodated within accommodation recess 280D ofreflection body 208. Optical filter 205 may be fixed to accommodationrecess 280D of reflection body 208 via a bonding material (not shown).Optical filter 205 may be fixed to light receiving element 202 via abonding material. Examples of the bonding material may include glasshaving a low melting point, alloy having a low melting point, and resinmaterial. Optical filter 205 is capable of preventing the detectiontarget gas from flowing from the space 240A side of optical member 204toward the light receiving element 202 side via second opening 282A.Similarly, optical filter 205 is capable of preventing opticalcharacteristics of light emitting element 201 and light receivingelement 202 from being deteriorated by dust or moisture entering fromthe space 240A side of optical member 204 via second opening 282A.

Board 206 is capable of outputting a signal received from the lightreceiving element 202 side to the outside. Light emitting element 201and light receiving element 202 are provided on the one surface side260A side of board 206. Optical member 204 is connectable to board 206.Board 206 may have a rectangular flat-plate-shaped external appearance.Board 206 is not limited to a rectangular flat-plate-shaped component,but may have various shapes such as a circular flat-plate shape and apolygonal flat-plate shape. As board 206, a glass epoxy resin substrateor a ceramic multilayered substrate may be used, for example. Electronicpart 271 constituting signal processing circuit unit 207 may be mountedon board 206, for example. Board 206 includes wiring 263. According toboard 206, light emitting element 202 can be electrically connected toelectronic part 271 constituting signal processing circuit 207 viawiring 263.

Board 206 includes conductor wiring 261 for outputting a signal fromlight receiving element 202 to the outside. According to board 206, thelight receiving element 202 side is electrically connected to conductorwiring 261 via wiring 263. In device 210, surface mounting typereceptacle 269 is allowed to be surface-mounted on conductor wiring 261of board 206 via soldering or the like. Device 210 is electricallyconnectable with a wiring board (not shown) of an external apparatus byusing receptacle 269. According to device 210, conductor wiring 261 maybe electrically connected to the wiring board of the apparatus side viametal terminals 265 as illustrated in FIG. 36, instead of use ofreceptacle 269. According to device 210 provided with metal terminals265, metal terminals 265 may be fixed to through holes (not shown)penetrating board 206. According to board 206, conductor wiring 261around the through holes may be electrically connected with metalterminals 265 via soldering (not shown) or the like after insertion ofmetal terminals 265 into the through holes.

Similarly, device 210 may include receptacle 266 which contains contactpins 268 within connector body 267 formed by insulation material asillustrated in FIG. 37, instead of receptacle 269. According to device210, contact pins 268 of receptacle 266 are electrically connected toconductor wiring 261. According to device 210, conductor wiring 261 iselectrically connected to a plug electrically connected with the wiringboard on the apparatus side via receptacle 266. Device 210 is capable ofbeing electrically connected to the wiring board on the apparatus sideby using of metal terminals 265, receptacle 266, or receptacle 269.Device 210 is preferably provided with screw holes 260C for receivingscrews or the like fixing device 210 to the wiring board (not shown) ofthe external apparatus.

Device 210 in a mode different from this exemplary embodiment ismanufacturable only by replacing board 206 containing conductor wiring261 with board 206 containing conductor wiring 261 of a different wiringpattern. This structure can standardize components constituting device210 and increase a degree of freedom for electric connection betweendevice 210 and an external apparatus provided outside device 210 foreach type of apparatus on which device 210 of this exemplary embodimentis mounted.

Signal processing circuit unit 207 is configured to allow emission ofinfrared light from light emitting element 201 by controlling lightemitting element 201. Signal processing circuit unit 207 is configuredto process a signal output from light receiving element 202 uponreceiving infrared light. Signal processing circuit unit 207 may performsignal processing such as amplification, waveform shaping, signalsampling, and signal analog/digital conversion of the signal output fromlight receiving element 202. Signal processing circuit unit 207 mayfurther perform signal processing such as signal calculation, signalcorrection, and determination that the detection target gas has anabnormal concentration, for example. Signal processing circuit unit 207may be constituted of electronic part 271 such as an integrated circuit.

Reflection body 208 is capable of reflecting infrared light. Reflectionbody 208 may be constituted by a resin molded component formed of asynthetic resin molded body. Reflection body 208 may be made ofpolyphthalamide resin, for example. Reflection body 208 may includeoutside surface 280C coated with metal material. Reflection body 208 maybe formed as a resin molded component on which metal material such asgold and aluminum is formed by deposition or plating. Reflection body208 may be formed as a resin molded component whose outside surface 280Cis coated with metal material. Reflection body 208 is not limited to aresin molded component, but may be made of metal material. For example,reflection body 208 may be made of metal material such as aluminum.Reflection body 208 whose outside surface 280C is made of metal iselectrically connectable with outside surface 240B of metal materialconstituting optical member 204.

Reflection body 208 includes first opening 281A through which infraredlight emitted from light emitting element 201 passes. Reflection body208 includes second reflection mirror 280AA on a circumference of firstopening 281A. Second reflection mirror 280AA converges infrared light ina direction perpendicular to one surface 260A. Reflection body 208includes second opening 282A through which infrared light reflected onthe opposed surface passes. Reflection body 208 includes thirdreflection mirror 280AC on a circumference of second opening 282A. Thirdreflection mirror 280AC converges infrared light on light receivingelement 202. The structure of reflection body 208 which includes secondreflection mirror 280AA and third reflection mirror 280AC for reflectinginfrared light is capable of increasing light utilization efficiency ofinfrared light.

In case of reflection body 208 formed as a resin molded component,shapes of first opening 281A and second opening 282A are relativelyeasily formed into paraboloidal surfaces in comparison with reflectionbody 208 made of metal material. According to device 210 in thisexemplary embodiment, cover member 209 is provided on the optical member204 side of reflection body 208. Optical member 204 covers lightemitting element 201. On the other hand, optical filter 205 is providedon the optical member 204 side of reflection body 208. Optical filter205 covers light receiving element 202. According to device 210, covermember 209 may be provided on reflection body 208 which covers lightemitting element 201 in such a position that cover member 209 faceslight emitting element 201 as illustrated in FIG. 38. Similarly, opticalmember 205 may be provided on reflection body 208 which covers lightreceiving element 202 in such a position that optical member 205 faceslight receiving element 202. In this case, reflection body 208 isprovided with accommodation recesses 280E where cover member 209 andoptical filter 205 are accommodated.

Cover member 209 is capable of closing first opening 281A. Cover member209 is capable of preventing a gas from flowing from the space 240A sideof optical member 204 toward the light receiving element 202 side viafirst opening 281A. Similarly, cover member 209 is capable of preventingoptical characteristics of light emitting element 201 and lightreceiving element 202 from being deteriorated by dust or moistureentering from the space 240A side of optical member 204 via firstopening 281A. Cover member 209 may have a flat plate shape, for example.It is preferable that cover member 209 is made of material havingexcellent translucency capable of transmitting infrared light emittedfrom light emitting element 201. Examples of material of cover member209 include Ge, Si and other semiconductor materials, and methacrylicresin.

Eighth Exemplary Embodiment

Device 210 according to this exemplary embodiment illustrated in FIGS.39 and 40 is different from device 210 according to the seventhexemplary embodiment illustrated in FIG. 33 chiefly in that opticalmember 204 and reflection body 208 are electrically connected with theboard 206 side. Constituent elements similar to correspondingconstituent elements in the seventh exemplary embodiment have been givensimilar reference numbers, and the same explanation is not repeated whenomission of the explanation is appropriate.

In device 210 in this exemplary embodiment, optical member 204 is formedas a resin molded component whose outside surface 240B is coated withmetal material, or a metal body made of metal material. For example, themetal material of optical member 204 is electrically connected withground of board 206 as illustrated in FIG. 39. According to device 210,optical member 204 may be joined to board 206 via soldering 213, therebyelectrically connecting the metal material of optical member 204 and theground of board 206. According to device 210, projections of opticalmember 204 are joined to lands around insertion holes 262A by soldering213, for example. In device 210, only the lands around insertion holes262A of board 206 need to be grounded.

Optical member 204 is a resin molded component formed of a syntheticresin molded body. Optical member 204 is gold-plated to form a metalportion (not shown) throughout outside surface 240B of optical member204. According to device 210, optical member 204 formed as a resinmolded component whose outside surface 240B is coated with metalmaterial is electrically connected with the lands around insertion holes262A of board 206 by soldering 213. In device 210, the lands aroundinsertion holes 262A of board 206 are grounded. In other words, opticalmember 204 is a resin molded component whose outside surface 240B iscoated with the metal portion of metal material, and the metal materialis electrically connected with the ground of board 206.

In device 210, a potential of optical member 204 coated with the metalportion of metal material may be set to a reference potential. In thiscase, device 210 prevents noise from occurring in light emitting element201, light receiving element 202, electronic part 271 or the like as aresult of entrance of electromagnetic waves from the outside of device210. Similarly, in device 210, a potential of reflection body 208contacting optical member 204 is allowed to be set to the referencepotential in accordance with setting of the potential of optical member204 coated with the metal portion of metal material to the referencepotential. By setting the potential of reflection body 208 to thereference potential, device 210 further prevents noise from occurring inlight emitting element 201 and light receiving element 202 provided onboard 206 and covered by reflection body 208, as a result of entrance ofelectromagnetic waves from the outside of device 210.

According to device 210 in this exemplary embodiment, for example, themetal material of reflection body 208 may be electrically connected withthe ground of board 206 as illustrated in FIG. 40. According to device210, the metal material of reflection body 208 may be electricallyconnected with the ground of board 206 by joining reflection body 208and board 206 using soldering 213. In device 210, the metal portion madeof metal material and formed on reflection body 208 only need to bejoined with the lands of board 206 by soldering 213, for example.According to device 210, a potential of reflection body 208 coated withthe metal material may be set to a reference potential. In this case,device 210 prevents noise from occurring in light emitting element 201,light receiving element 202, electronic part 271 or the like as a resultof entrance of electromagnetic waves from the outside of device 210.Similarly, according to device 210, a potential of optical member 204contacting reflection body 208 is allowed to be set to the referencepotential in accordance with setting of the potential of reflection body208 coated with metal material to the reference potential. By settingthe potentials of optical member 204 and reflection body 208 to thereference potential, device 210 further prevents noise from occurring inlight emitting element 201, light receiving element 202 or the likecovered by reflection body 208 as a result of entrance ofelectromagnetic waves from the outside of device 210.

Ninth Exemplary Embodiment

Device 210 according to this exemplary embodiment illustrated in FIGS.41 and 42 is different from device 210 according to the seventhexemplary embodiment illustrated in FIG. 33 chiefly in that lightemitting element 201 and light receiving element 202 are mounted on theone surface 260A side of board 206 via support body 203, rather thanmounted directly on one surface 260A of board 206. Constituent elementssimilar to corresponding constituent elements in the seventh exemplaryembodiment have been given similar reference numbers, and the sameexplanation is not repeated when omission of the explanation isappropriate.

In device 210 in this exemplary embodiment, light emitting element 201and light receiving element 202 are provided on support body 203 whichsupports light emitting element 201 and light receiving element 202 witha predetermined distance therebetween as illustrated in FIGS. 41 and 42.Support body 203 is provided on the one surface 260A side of board 206.

Support body 203 is capable of supporting light emitting element 201 andlight receiving element 202 on the one surface 230A side. Support body203 may have a bottomed and square cylindrical external shape. Supportbody 203 may be constituted by a resin molded component formed of asynthetic resin molded body. Support body 203 may be made ofpolyphthalamide resin, for example. One surface 260A of board 206 isexposed through cylindrical opening 230B of support body 203.

Support body 203 is provided with first recess 233 on the one surface230A side of support body 203. Light emitting element 201 is mounted onan inner bottom surface of first recess 233 of support body 203.According to device 210, light emitting element 201 is mounted on theinner bottom surface of first recess 233 via a die bond material (notshown). In device 210, light emitting element 201 is electricallyconnected to wiring 263 provided on one surface 260A of board 206 and bywire bonding using metal wire 212, for example. Light emitting element201 is constituted by a light emitting diode capable of emittinginfrared light. This light emitting diode is constituted by asemiconductor bare chip.

Support body 203 is provided with second recess 234 on the one surface230A side of support body 203. Light receiving element 202 is mounted onan inner bottom surface of second recess 234 of support body 203.According to device 210, light receiving element 202 is mounted on theinner bottom surface of second recess 234 via a die bond material (notshown). In device 210, light receiving element 202 is electricallyconnected to wiring 263 formed on one surface 260A of board 206 by wirebonding using metal wire 212. Light receiving element 202 is constitutedby an infrared sensor capable of receiving infrared light. The infraredsensor is constituted by a pyroelectric element. The infrared sensor isprovided as a semiconductor bare chip. Support body 203 supports lightemitting element 201 and light receiving element 202 on the one surface230A side. In case of support body 203, reflection body 208 is providedon the one surface 230A side of support body 203 so as to cover lightemitting element 201 and light receiving element 202.

Support body 203 is provided with accommodation recess 230D formed inone surface 230A of support body 203. Support body 203 accommodatesreflection body 208 within accommodation recess 230D of support body 203in a manner that reflection body 208 covers opening 230B. According todevice 210, reflection body 208 can be positioned with respect tosupport body 203 by accommodation of reflection body 208 withinaccommodation recess 230D. According to device 210, alignment betweenlight emitting element 201 and second reflection mirror 280AA isfacilitated by accommodation of reflection body 208 within accommodationrecess 230D. According to device 210, alignment between light receivingelement 202 and third reflection mirror 280AC is facilitated byaccommodation of reflection body 208 within accommodation recess 230D.According to device 210, light emitting element 201 can be positioned ata focus of a parabolic reflection surface of second reflection mirror280AA by accommodation of reflection body 208 within accommodationrecess 230D. According to device 210 of this exemplary embodiment, lightreceiving element 202 can be positioned at a focus of a parabolicreflection surface of third reflection mirror 280AC by accommodation ofreflection body 208 within accommodation recess 230D.

In device 210, optical member 204 is overlaid on board 206 via supportbody 203 and reflection body 208 by insertion of projections of opticalmember 204 into insertion holes 262A of board 206. According to device210, optical member 204 is fixed to board 206 via support body 203 in astate of insertion of the projections of optical member 204 intoinsertion holes 262A of board 206. In device 210, the projections ofoptical member 204 can be joined and fixed to lands 262 around insertionholes 262A of board 206 by soldering 213, for example. In device 210,support body 203 is fixed with reflection body 208 by using a not-shownadhesive. According to device 210, infrared light emitted from lightemitting element 201 is allowed to pass through first opening 281A bymounting of reflection body 208 on support body 203. According to device210 in this exemplary embodiment, light receiving element 202 is allowedto receive infrared light after passing through second opening 282A bymounting of reflection body 208 on support body 203.

In device 210 according to this exemplary embodiment, reflection body208, optical member 204, and support body 203 on which light emittingelement 201 and light receiving element 202 are mounted are opticallycoupled. In addition, in device 210, support body 203 and optical member204 are fixed to board 206 which does not require relatively highalignment accuracy in comparison with the optical coupling whichrequires relatively high alignment accuracy. According to device 210,conductor wiring 261 for outputting a signal received from the lightreceiving element 202 side to the outside is provided on board 206 whichdoes not require relatively high alignment accuracy, and therefore adegree of freedom for electric connection to the outside is furtherincreased. In other words, in device 210 according to this exemplaryembodiment, support body 203 which holds light emitting element 201 andlight receiving element 202 with a predetermined distance therebetweenis functionally separated from board 206 which includes conductor wiring261 for outputting signals to the outside in accordance with accuracy ofalignment.

Accordingly, device 210 in a mode different from this exemplaryembodiment is manufacturable only by replacing board 206 containingconductor wiring 261 with board 206 containing conductor wiring 261 of adifferent wiring pattern. This structure can standardize componentsconstituting device 210 and increase a degree of freedom for electricconnection between device 210 and an external apparatus provided outsidedevice 210 for each type of apparatus on which device 210 of thisexemplary embodiment is mounted.

Tenth Exemplary Embodiment

Device 210 according to this exemplary embodiment is different fromdevice 210 according to the seventh exemplary embodiment illustrated inFIG. 33 in that two or more sets of optical filter 205 and lightreceiving element 202 are provided for one light emitting element 201,instead of one set of optical filter 205 and light receiving element 202for one light emitting element 201. Constituent elements similar tocorresponding constituent elements in the seventh exemplary embodimenthave been given similar reference numbers, and the same explanation isnot repeated when omission of the explanation is appropriate.

According to device 210 in this exemplary embodiment, optical filters205 are provided for light receiving elements 202, respectively, so asto cover a pair of light receiving elements 202 as illustrated in FIG.43. The pair of light receiving elements 202 are hereinafter referred toas first light receiving element 221 and second light receiving element222 as well. In device 210 according to this exemplary embodiment, oneof optical filters 205 provided for the pair of light receiving elements202, respectively, constitutes first optical filter 251 which has atransmission band containing an infrared light wavelength band absorbedby a detection target gas. On the other hand, according to device 210,the other of optical filters 205 provided for the pair of lightreceiving elements 202, respectively, constitutes second optical filter252 which does not have a transmission band containing the wavelengthband of the infrared light absorbed by the detection target gas, but hasa transmission band containing wavelengths around the wavelength band ofthe infrared light absorbed by the detection target gas.

According to device 210 in this exemplary embodiment, therefore, opticalfilters 205 include first optical filter 251 which has a transmissionband containing an infrared light wavelength band absorbed by thedetection target gas, and second optical filter 252 which has atransmission band different from the transmission band of first opticalfilter 251. Light receiving elements 202 includes first light receivingelement 221 which photoelectrically converts infrared light transmittedthrough first optical filter 251, and second light receiving element 222which photoelectrically converts infrared light transmitted throughsecond optical filter 252.

According to device 210, reflection body 208 includes first opticalfilter 251 and second optical filter 252. Reflection body 208 includessecond opening 282A through which infrared light reflected on theopposed surface passes. Reflection body 208 further includes thirdopening 282B through which the infrared light reflected on the opposedsurface passes. According to device 210, reflection body 208 may includefirst reflection body 286 containing first opening 281A, and secondreflection body 287 containing second opening 282A and third opening282B. First through third openings 281A through 282B may be providedeither as separate bodies or as an integrated body.

Device 210 is capable of introducing the outside air into space 240A ofoptical member 204 via air hole 242. According to device 210, an amountof infrared light transmitted through first optical filter 251 andreceived by first light receiving element 221 decreases with respect tothat of infrared light emitted from light emitting element 201 inaccordance with a concentration of the detection target gas. Accordingto device 210, when the concentration of the detection target gas islow, an amount of infrared light received by first light receivingelement 221 becomes close to the amount of infrared light emitted fromlight emitting element 201. When the concentration of the detectiontarget gas is high, the amount of infrared light received by first lightreceiving element 221 decreases. According to device 210, an amount ofinfrared light transmitted through second optical filter 252 andreceived by second light receiving element 222 does not vary inaccordance with the concentration of the detection target gas.

In device 210, signal processing circuit unit 207 processes a signalindicating an amount of received infrared light and output from lightreceiving element 202. Device 210 is capable of detecting aconcentration of the detection target gas contained in space 240A ofoptical member 204.

According to device 210 in this exemplary embodiment, signal processingcircuit unit 207 calculates the concentration of the detection targetgas based on a difference between signal levels output from the pair oflight receiving elements 202. Signal processing circuit unit 207 obtainsthe difference between the signal levels output from first lightreceiving element 221 and second light receiving element 222, andcalculates the concentration of the detection target gas based on thisdifference.

When signal processing circuit unit 207 of device 210 calculates aconcentration of a gas based on only the signal level output from one oflight receiving elements 202, detection accuracy at the time ofdetection of the concentration of the gas may lower due to a variationof the signal level output from light receiving element 202 caused bysome disturbance factor.

However, signal processing circuit unit 207 of device 210 according tothis exemplary embodiment calculates a concentration of the detectiontarget gas based on a difference between signal levels output from firstlight receiving element 221 and second light receiving element 222.Accordingly, lowering of detection accuracy at the time of detection ofthe concentration of the gas is suppressed according to device 210 bycanceling variations caused by some disturbance factor based on thedifference between the signal levels output from first light receivingelement 221 and second light receiving element 222.

While not shown in the figure, optical filters 205 of device 210 mayinclude a third optical filter which has a transmission band differentfrom the respective transmission bands of first optical filter 251 andsecond optical filter 252. Light receiving element 202 may include athird light receiving element which photoelectrically converts infraredlight after passing through the third optical filter.

Thanks to the structure, device 210 according to this exemplaryembodiment is capable of detecting a plurality of types of gases. Device210 discussed in the seventh exemplary embodiment is a gas sensor fordetecting one type of gas contained in the outside air. However, a gassensor capable of detecting different types of gases for each set oflight receiving element 202 and optical filter 205 is realizable when aplurality of sets of light receiving element 202 and optical filter 205are equipped. Device 210 according to this exemplary embodiment includestwo or more sets of light receiving element 202 and optical filter 205.Accordingly, concentrations of different types of gases are detectablebased on outputs from respective light receiving elements 202.

More specifically, device 210 includes first light receiving element 221as light receiving element 202 for gas detection. Device 210 includessecond light receiving element 222 as light receiving element 202 forgas detection. In device 210 in this exemplary embodiment, each ofoptical filters 205 constitutes a band pass filter which has atransmission band containing a predetermined wavelength. Device 210which includes a plurality of sets of optical filter 205 and receivingelement 202 for gas detection is capable of detecting a plurality oftypes of gases. Device 210 is thus capable of independently detectingconcentrations of two different types of gases from a plurality of typesof gases contained in the outside air. Device 210 according to thisexemplary embodiment is capable of simultaneously detecting both of afirst gas (such as carbon monoxide) and a second gas (such as nitrogenoxide) among two types of gases. Moreover, device 210 according to thisexemplary embodiment may include a third optical filter which transmitsa band not absorbed by either the first gas or the second gas. The thirdlight receiving element receives infrared light transmitted through thethird optical filter, and outputs a signal generated by photoelectricconversion to signal processing circuit unit 207. Signal processingcircuit unit 207 measures a signal change ratio from initial output fromlight emitting element 201 based on the signal output from the thirdlight receiving element. According to device 210, signal processingcircuit unit 207 after measuring the signal change ratio from theinitial output from light emitting element 201 corrects output fromfirst light receiving element 221 and output from second light receivingelement 222. Device 210 is capable of eliminating effects ofdeterioration of light emitting element 201 with time or the like, andimproving measurement accuracy by correcting the signals output fromfirst light receiving element 221 and second light emitting element 222.

A device according to the present disclosure is capable of increasing adegree of freedom for electric connection with an outside, andapplicable to a gas detecting device for detecting a particularsubstance, for example.

1. A device comprising: a light emitting element; a light receivingelement; an electronic part capable of processing a signal output fromthe light receiving element; an optical member covering the lightemitting element and the light receiving element; and a board on whichthe light emitting element, the light receiving element, the electronicpart, and the optical member are mounted, wherein the board includesconductor wiring electrically connected to the light receiving element.2. The device according to claim 1, wherein an upper surface of thelight emitting element and an upper surface of the light receivingelement are disposed at positions higher than a position of an uppersurface of the electronic part.
 3. The device according to claim 1,further comprising a support body disposed between the board and theoptical member, wherein the light emitting element and the lightreceiving element are mounted on the support body, and the electronicpart is mounted directly on the board.
 4. The device according to claim1, wherein the electronic part is disposed in a space surrounded by theoptical member and the board.
 5. The device according to claim 1,further comprising a reflection body disposed above the light emittingelement and the light receiving element, and provided with a firstopening immediately above the light emitting element and a secondopening immediately above the light receiving element.
 6. The deviceaccording to claim 5, wherein the first opening has a shape flaring withfarness from the surface of the board in a direction perpendicular to asurface of the board, and the second opening has a shape flaring withfarness from the surface of the board in a direction perpendicular tothe surface of the board.
 7. The device according to claim 5, whereinthe optical member includes a first reflection mirror, the reflectionbody includes a second reflection mirror provided on an inner wallwithin the first opening, and a third reflection mirror provided on aninner wall within the second opening.
 8. The device according to claim5, wherein the reflection body is made of metal, and electricallyconnected with the optical member.
 9. The device according to claim 5,wherein the reflection body includes a first translucent cover memberclosing the first opening, and a second translucent cover member closingthe second opening.
 10. The device according to claim 1, wherein theoptical member includes metal material electrically connected to groundof the board.
 11. The device according to claim 1, further comprising anoptical filter laid on an optical path for guiding infrared light fromthe light emitting element toward the light receiving element side, andcapable of transmitting infrared light in a predetermined wavelengthband.
 12. The device according to claim 11, wherein the optical filterincludes a first optical filter having a transmission band containing awavelength band of infrared light absorbed by gas that is a detectiontarget, and a second optical filter having a transmission band differentfrom the transmission band of the first optical filter, and the lightreceiving element includes a first light receiving element capable ofphotoelectrically converting infrared light transmitted through thefirst optical filter, and a second light receiving element capable ofphotoelectrically converting infrared light transmitted through thesecond optical filter.
 13. The device according to claim 1, wherein theoptical member includes one end side, and the other end side on a sideopposite to the one end side in a plan view, the light emitting elementis present on the one end side, and the light receiving element ispresent on the other end side.
 14. The device according to claim 1,wherein light emitted from the light emitting element is reflected on aside opposite to a side where the light emitting element is disposed,and is guided toward the light receiving element disposed on a sidewhere the light emitting element is disposed.
 15. The device accordingto claim 1, wherein the optical member includes one end side, and theother end side on a side opposite to the one end side in a plan view,and each of the light emitting element and the light receiving elementis present at a position nearer to the one end side than the electronicpart is.
 16. The device according to claim 1, wherein light emitted fromthe light emitting element travels in a direction perpendicular to thesurface of the board, and light after reflection travels in a directionperpendicular to the surface of the board toward the light receivingelement.
 17. The device according to claim 1, wherein the optical memberhave a larger length in a vertical direction than in a planar direction.18. The device according to claim 1, wherein the optical member guideslight emitted from the light emitting element toward the light receivingelement.